Mlink 294 Direct Heat Stencils Pack for BGA Reballing and Precise Soldering

Mlink 294 Direct Heat Stencils Pack is a complete set of stencils for direct heat soldering, designed for professionals and electronics repair workshops. This pack includes a wide range of stencils adapted to different Soler Ball sizes, from 0.30 mm to 0.76 mm, covering a broad variety of chips and electronic components.

This pack is ideal for BGA reballing work, allowing precise solder application on chips from well-known brands such as Intel, ATI, NVidia, AMD, VIA, and others, making it easier to repair and maintain integrated circuits and microcomponents in laptops, consoles and electronic devices.

• Wide compatibility: Includes stencils for Intel chips (82801HB, LGA1155, LGA1156, among others), ATI (various models), NVidia (MCP67MV-A2, GF104, GT215, etc.), AMD, VIA, and more.
• Various Soler Ball sizes: 0.30 mm, 0.35 mm, 0.40 mm, 0.45 mm, 0.50 mm, 0.60 mm and 0.76 mm, covering a range of soldering needs.
• Professional use: Perfect for electronics repair workshops, BGA reballing, and chip soldering in devices such as laptops, Xbox 360 consoles, PS3, and others.
• Mlink quality: A recognised brand in soldering tools and accessories, ensuring precision and durability.

This pack makes the reballing process easier, improving the quality and efficiency of BGA chip and other electronic component repairs. Its design allows for even and controlled solder application, essential to avoid damage and ensure reliable connections.

What does the 294 Direct Heat Stencils Pack include?

The pack contains specific stencils for multiple models and sizes, including:

• Universal stencils for each Soler Ball size.
• Stencils for Intel, ATI, NVidia, AMD, VIA, and other models detailed in the technical description.
• More than 294 stencils covering a wide range of reballing and soldering applications.

Typical applications:

• Repair of BGA chips in laptops and electronic devices.
• Precise soldering of microcomponents in Xbox 360, PS3, and PSP consoles.
• Maintenance and repair of motherboards and integrated circuits.

Compatibility and recommendations: This pack is compatible with soldering stations and professional reballing tools. It is recommended for use by specialised technicians to ensure optimal results.

With the Mlink 294 Direct Heat Stencils Pack, you get an essential tool for reballing and advanced soldering work, ensuring precision, quality and efficiency in every repair.

• Includes 294 stencils for direct heat soldering.
• Compatible with Intel, ATI, NVidia, AMD, VIA and more chips.
• Covers Soler Ball sizes from 0.30 mm to 0.76 mm.
• Ideal for BGA reballing and microcomponent repair.
• Mlink brand recognised in professional soldering tools.