Professional, precise BGA repair stencil plate for iPhone 6PLUS
Brand: Mlink
VAT included (Ex VAT: 3.00 €)
Volume Discounts
| Quantity | Price | Save |
|---|---|---|
| 2+ | 3.54 € | -4% |
| 10+ | 3.36 € | -9% |
| 20+ | 2.95 € | -20% |
The iPhone 6PLUS IC stencil plate is an essential tool for electronics repair technicians and hobbyists working with Apple devices. This direct heat template is specifically designed to hold all BGA ICs for the iPhone 6PLUS, making the soldering and reballing process efficient and precise.
Main features:
- Compatibility: Exclusively for iPhone 6PLUS, ensuring a perfect fit for the BGA ICs of this model.
- Template type: Direct heat template that allows even heat transfer for optimal reballing.
- Professional use: Ideal for repair shops and technicians specialising in Apple devices.
- Durable material: Made from durable materials that withstand high temperatures during the soldering process.
Typical uses:
- Reballing and repair of BGA chips in iPhone 6PLUS.
- Replacement of damaged or faulty ICs on the device motherboard.
- Maintenance and restoration of iPhone 6PLUS functionality using advanced soldering techniques.
Compatibility and accessories: This template is compatible with soldering stations and standard reballing tools used in iPhone repair. It is recommended to use it together with direct heat accessories for the best results.
The iPhone 6PLUS IC stencil plate is an indispensable accessory for those seeking precision and quality in BGA component repair. Its design specific to this model ensures efficient, professional work, improving the success rate in complex repairs.
- Direct heat template for iPhone 6PLUS BGA ICs
- Exclusively compatible with iPhone 6PLUS
- High-temperature-resistant material for safe soldering
- Ideal for professional reballing and repair
- Improves precision and efficiency in BGA repairs
Customer Questions & Answers
Which models is this stencil plate compatible with?
This stencil plate is compatible exclusively with the iPhone 6PLUS and is designed for its BGA ICs.
What type of repair can be carried out with this template?
It allows reballing and soldering of BGA chips on the iPhone 6PLUS motherboard.
Is it suitable for professional use?
Yes, it is designed for technicians and workshops specialising in Apple device repair.
What tools are needed to use this template?
It is recommended to use it with soldering stations and direct heat tools compatible with BGA templates.
Does the template include all the ICs needed for the iPhone 6PLUS?
Yes, it contains all the BGA ICs for the iPhone 6PLUS to make the repair process easier.