3.69 €
In Stock
iPhone 6s Plus stencil plate for professional reballing and repair
Brand: Mlink
3.69€
VAT included (Ex VAT: 3.00 €)
Volume Discounts
| Quantity | Price | Save |
|---|---|---|
| 2+ | 3.54 € | -4% |
| 10+ | 3.36 € | -9% |
| 20+ | 2.95 € | -20% |
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Fri, May 1 - Tue, May 5
Express delivery
Wed, Apr 29 - Thu, Apr 30
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The iPhone 6s Plus stencil plate from Mlink is a specialised tool for mobile device repair professionals, specifically designed for the reballing process of BGA ICs on the iPhone 6s Plus.
This direct heat stencil allows precise and even application of solder balls onto BGA chips, making it easier to repair and maintain the iPhone 6s Plus logic board. Its design includes all the necessary positions for the device's original BGA ICs, ensuring compatibility and efficiency in the job.
Key features
- Compatibility: Specifically designed for BGA ICs on the iPhone 6s Plus.
- High-quality material: Made to withstand direct heat during the reballing process without warping.
- Precision: Allows exact alignment of solder balls, improving repair quality.
- Professional use: Ideal for technicians and workshops specialising in mobile phone repair.
Typical uses
- Reballing BGA chips on the iPhone 6s Plus logic board.
- Repairing faults related to defective solder joints in BGA ICs.
- Maintenance and restoration of Apple mobile devices.
Compatibility and accessories
This stencil is compatible exclusively with the iPhone 6s Plus and its original BGA ICs. It is recommended to use it together with soldering stations and reballing tools for optimal results.
It is also part of the range of iPhone 6s Plus reballing accessories and iPhone 6s Plus repair tools offered by Mlink, ensuring quality and precision in every repair.
- Compatible with BGA ICs on the iPhone 6s Plus
- Heat-resistant material for direct reballing
- Enables precise alignment of solder balls
- Ideal for mobile phone repair technicians
- Essential tool for reballing and maintenance
Customer Questions & Answers
What is the iPhone 6s Plus stencil plate used for?
It is used to make the reballing process of BGA ICs on the iPhone 6s Plus logic board easier, allowing precise soldering.
Is it compatible with other iPhone models?
No, this stencil plate is designed exclusively for BGA ICs on the iPhone 6s Plus.
What material can the stencil plate withstand?
It is made from materials resistant to the direct heat needed for the reballing process.
Where can I buy this stencil plate?
It is available to buy online at satkit.com with fast and secure delivery.
Do I need additional tools to use the stencil plate?
Yes, it is recommended to use it together with soldering stations and reballing tools for better results.
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