Pack 431 Direct Heat Stencils for BGA Reballing - Mlink Templates

Mlink Pack 431 Direct Heat Stencils is a professional kit designed to make BGA reballing and direct heat soldering easier. This pack includes a wide range of templates (stencils) for different solder ball sizes, from 0.25 mm to 0.76 mm, covering a broad range of chips and electronic components.

This set is ideal for technicians and professionals who work with soldering stations and need precise, reliable accessories for electronic board repair and maintenance.

Pack Contents

• Stencils for 0.25 mm solder balls (1 piece)
• Stencils for 0.30 mm solder balls (9 pieces), including universal models and compatible with Intel 82801 IUX, SIRF AT640, MTK MT6226/8226, Infineon TECH PMB7850, Intel BD 82HM65, among others.
• Stencils for 0.35 mm solder balls (6 pieces) compatible with Intel AC82GS45, Intel AF82US15W, Intel BD82HM55, and more.
• Stencils for 0.40 mm solder balls (5 pieces) with compatibility for Intel BD82P55, Intel I7-620M, NV MCP79U-B2 / nVIDIA GeForce 9400M G, etc.
• Stencils for 0.45 mm solder balls (17 pieces) for DDR1, DDR2, DDR3 RAM, Intel chips and other specific components.
• Stencils for 0.50 mm solder balls (63 pieces) compatible with ATI, NVidia, Intel, and other leading models.
• Stencils for 0.60 mm solder balls (104 pieces) for multiple NVidia, ATI, Microsoft Xbox 360, Sony PS3, Nintendo Wii chips and more.
• Universal stencils for sizes between 0.25 mm and 0.76 mm (18 pieces).
• Specific stencils for MTK / IPHONE4 (16 pieces) and other mobile chip models (32 pieces).
• Stencils for the iPhone 4, 4S, 3G, 3GS series (46 pieces).

Features and Benefits

• Wide compatibility: Compatible with a wide variety of Intel, ATI, NVidia, MTK, Sony, Nintendo, Microsoft Xbox chips and more.
• Range of sizes: Includes stencils for solder balls from 0.25 mm to 0.76 mm, adapting to different reballing needs.
• High precision: Templates designed for a perfect fit, making solder ball application easier and improving soldering quality.
• Durable material: Made with durable materials that withstand direct heat during the soldering process.
• Optimised for soldering stations: Ideal for use with soldering stations and professional reballing tools.

Typical Uses

This pack is especially useful for electronics repair technicians who carry out:

• BGA chip reballing to repair faulty connections.
• Repair and maintenance of motherboards, graphics cards, and other electronic devices.
• Precise application of solder balls in direct heat soldering processes.

Compatibility

The Pack 431 Direct Heat Stencils is compatible with a wide range of electronic components, including:

• Intel chips (various models such as 82801 IUX, BD82HM65, LGA1155, LGA1156, among others).
• ATI and NVidia graphics cards (models such as ATI 21514, NV GF104, ATI X1600, NV MCP79U-B2, etc.).
• MTK mobile devices and Apple iPhone series.
• Video game consoles such as Microsoft Xbox 360, Sony PS3, Nintendo Wii.

Basic Instructions for Use

To use the templates in this pack, it is recommended to:

• Select the appropriate template according to the solder ball size and the chip being worked on.
• Place the template accurately over the chip or board.
• Apply the solder balls into the holes in the template.
• Carry out the direct heat soldering process following the soldering station instructions.

Conclusion

The Mlink Pack 431 Direct Heat Stencils is a complete, professional solution for BGA reballing and soldering work. Its wide variety of templates and compatibility with multiple devices make it an essential tool for specialist electronics repair technicians.

• Includes 431 stencils for solder balls from 0.25 mm to 0.76 mm
• Compatible with Intel, ATI, NVidia, MTK, Apple iPhone, and Xbox, PS3, Nintendo consoles
• High precision for BGA reballing and direct heat soldering applications
• Heat-resistant material, ideal for professional soldering stations
• Wide range of universal and specific templates for different chip models