Pack of 79 Direct Heat Stencils for BGA Soldering and Electronics Repair

The Pack 79 Stencils Calor Directo from Mlink is a complete set of templates designed to make direct heat soldering easier in electronics repair applications and console and motherboard maintenance. This pack is especially useful for BGA reballing work, offering broad compatibility with chips and electronic components across a range of technologies.

Contents and compatibility:

• Templates for 0,45 mm solder balls: DDR1, DDR2, XBOX Cache, DDR3, AC82GM45, 82PM45, 82GL40, AC88CTPM, AC82P45, AC82P43.
• Templates for 0,5 mm solder balls: Models G96-600-A1, G94-300-A1, SB700, RD780, ATI21514, 216PVAVA12FG, 215CDABKA15FG, X2600PRO, M64-M, M74-M, ATI1100, 1150, RS485M, ATI X1300, ATI IXP600, SB600, ATI RS800ME, RS600ME, ATI21515, 216-0707011, M72-S, M82-S, ATI200M RC415MD, ATI 700M, MCP67MV-A2, MCP77MV-A2, ATI IXP460, LE82PM965, GM965, 965, 945GM, 945PM, 945GMS, QG82945P, 82945GC, GF GO7200, 7300, 7400-N-A3, 6200AGP, G86-630-A2, NQ82915GMS, NF-6100-N, NF-7050-630A-A2, 8200, 8400, 8600, universal 0,5 mm template, 215-0719090.
• Templates for 0,6 mm solder balls: Xbox 360 GPU, Xbox 360 CPU, Xbox 360 Southbridge, Xbox CSP, Xbox 360 HANA, AV, PS3 GPU, PS3 CPU, PS3-CXR714120, VIACN896, VN896, P4M900, NF430-N-A3, NF-410-N-A3, VT8237A, VT8237, VT8235, 82801GBM, 82801GR, 82801GB, 82801FBM, 82801HBM, 82801IBM, SIS 964L, ATIX1600, RV516, X1300, X700, ATI9000 64M, SIS671, SIS671DX, SIS661FX, NF550, NF570, 82915P, ATI200M, HSI-A4, RG82865PE, ATI RC410MB, ATI200 M, NF4-N-A3, NF4-A3, NV GO6200, 7200, 7300, 7400, G84-303-A2, G86-771-A2, ATI7500, 9000, CSP-32, FGO5200, GO5200, GO5700, 4200GO, ATI IXP400, IXP450, ATI9200, 9600, 9700, X300, X600, MX440, QG82915PM, GM, NF-G6150-N-A2, NF-6100-A2, NF250, GO 6800, 6600, 82801IB, IR, FX5900, 82801BA, universal 0,6 mm templates with different pitches.
• Templates for 0,76 mm solder balls: M1671, 845GL, 845GV, 855GME, 855GM, 82801DBM, 82801CAM, 82801DB, 845MP, 855PM, 82801EB, universal 0,76 mm template with 1,27 mm pitch, SIS630E, SIS630S.

Main features:

• Wide range of templates for different solder ball sizes: 0,45 mm, 0,5 mm, 0,6 mm and 0,76 mm.
• Compatible with a large number of chips and electronic components, including Xbox 360 and PS3 consoles.
• Ideal for reballing and electronic board repair work.
• Made by Mlink, recognised in the soldering stations and tools sector.
• Helps improve precision when applying solder balls for a professional result.

Typical uses:

• Repair and maintenance of Xbox and PS3 consoles.
• BGA chip reballing on motherboards and graphics cards.
• Direct heat soldering for advanced electronics.
• Use in electronics repair workshops and hardware maintenance.

This pack is an essential tool for technicians and professionals who need precision and efficiency when soldering BGA electronic components, helping deliver optimal results in complex repairs.

• Includes 79 templates for direct heat soldering.
• Compatible with 0,45 mm, 0,5 mm, 0,6 mm and 0,76 mm solder balls.
• Suitable for reballing Xbox 360 and PS3 consoles.
• Wide compatibility with BGA chips and components.
• Made by Mlink, a specialist in soldering tools.