3.69 €
In Stock
Pack of 10 Universal BGA Reballing Stencils 0.3 to 0.76 mm
Brand: Mlink
3.69€
VAT included (Ex VAT: 3.00 €)
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The Pack of 10 Universal BGA Reballing Stencils for Direct Heat is an essential set for professionals and electronics repair technicians working with BGA chips. These stencils are designed to make the reballing and rework process easier using direct heat, offering precision and durability with every use.
Made from high-quality stainless steel, these stencils withstand direct heat applied by hot air guns, allowing efficient and safe work. Their universal design covers a wide range of solder ball sizes, from 0,3 mm to 0,76 mm, adapting to different repair needs.
Key features:
- Material: heat-resistant stainless steel
- Compatible with hot air guns for direct heat
- Includes 10 universal stencils in assorted sizes: 0,3 mm, 0,35 mm, 0,4 mm, 0,45 mm, 0,5 mm, 0,55 mm, 0,6 mm (pitch 1,0 mm), 0,6 mm (pitch 0,9 mm), 0,6 mm (pitch 1,1 mm) and 0,76 mm
- Universal design for different BGA chips
Uses and applications:
This kit is ideal for technicians specialising in the repair of electronic devices, including computers, game consoles and motherboards. It allows precise reballing processes, making BGA chip soldering easier and ensuring a durable and effective repair.
The stencils are compatible with most soldering stations and rework equipment that use direct heat, making them easy and practical to integrate into the workshop.
Package contents:
- 10 universal stencils in different sizes for BGA reballing
Advantages of using stainless steel universal BGA stencils:
- High heat resistance and durability
- Easy direct heat application with a hot air gun
- Versatility for different chip sizes and types
- Improves precision in soldering and repair
With this pack, technicians can optimise their repair processes, ensuring professional results and maximum compatibility with different electronic devices.
- Pack of 10 universal BGA reballing stencils from 0.3 to 0.76 mm
- Made from heat-resistant stainless steel
- Compatible with hot air guns for direct heat
- Includes stencils with 0.9 mm, 1.0 mm and 1.1 mm pitch
- Ideal for BGA chip repair in computers and electronic devices
Customer Questions & Answers
What advantages do stainless steel universal BGA stencils offer compared with options made from other materials?
Stainless steel universal BGA stencils resist deformation at high temperatures and are more durable than materials such as copper or brass. Their corrosion resistance helps maintain hole accuracy with repeated use under direct heat. However, they are less flexible than brass and require careful handling to avoid bending.
What are the exact dimensions and thicknesses of each stencil included in the pack, and are they compatible with most BGA chips on the market?
Each stencil has hole diameters between 0.3 mm and 0.76 mm, and the typical stainless steel thickness is approximately 0.12 mm. They include pitches of 0.9 mm, 1.0 mm and 1.1 mm. These sizes cover most common BGA chip packages, but they do not guarantee full compatibility with very specific models or proprietary packages.
For reballing with this set, do I need any specific additional tool, or will a standard heat gun do?
The stencils are designed for use with hot air guns between 300 and 500 °C, common in standard soldering stations. No exclusive tools are required, but it is recommended to use a holder to secure them and prevent movement during reheating, as well as solder balls of the correct diameter.
Is it possible to clean and reuse the stencils without the holes deteriorating or affecting accuracy?
Yes, stainless steel stencils can be cleaned after each use with solvents (e.g. isopropyl alcohol) and soft brushes. Their wear resistance allows dozens or more cycles of use if scratching or bending is avoided. Avoid cleaning with metal scouring pads to maintain hole accuracy.
What performance differences might I find compared with custom stencils for a specific chip model?
Universal stencils offer versatility for various BGA chips, but they may show slight misalignment or ball-size differences on some uncommon models. Custom stencils ensure absolute precision for a specific package, optimising solder flow and reducing the chance of bridges. The difference is noticeable only in demanding cases or high-density packages.
What is this pack of universal BGA stencils used for?
This pack is used to make the reballing and repair of BGA chips easier using direct heat, ensuring precise and durable soldering.
What material are the stencils made from?
The stencils are made from stainless steel, which gives them heat resistance and durability.
Are they compatible with hot air guns?
Yes, the stencils are designed to be heated directly with hot air guns during the reballing process.
What stencil sizes are included in the pack?
It includes 10 stencils in sizes from 0.3 mm to 0.76 mm, including variants with 0.9 mm, 1.0 mm and 1.1 mm pitch.
Can I use these stencils to repair chips in game consoles?
Yes, they are suitable for repairing BGA chips in a range of electronic devices, including game consoles and computers.
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