3.69 €
In Stock
Samsung Note 5 IC reballing stencil plate with professional precision
Brand: Mlink
3.69€
VAT included (Ex VAT: 3.00 €)
Volume Discounts
| Quantity | Price | Save |
|---|---|---|
| 2+ | 3.54 € | -4% |
| 10+ | 3.36 € | -9% |
| 20+ | 2.95 € | -20% |
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Samsung Note 5 IC reballing stencil plate
This Mlink stencil plate is a direct heat template that contains all the BGA ICs of the Samsung Note 5, making repair and maintenance of this mobile device easier. It is designed for electronics repair professionals who require precision and efficiency when working with BGA components.
Key features
- Compatibility: Exclusive for Samsung Note 5, ensuring a perfect fit and optimal results.
- Quality material: Made with heat-resistant materials to withstand reballing and soldering processes.
- Integrated design: Includes all the BGA ICs of the Samsung Note 5 in a single template to simplify the process.
- Professional use: Ideal for repair workshops that carry out BGA soldering and high-precision reballing.
Typical uses
This stencil plate is mainly used for reballing BGA chips on the Samsung Note 5. It allows solder balls to be applied precisely to the ICs, making it easier to repair faults related to defective or damaged connections on the phone's motherboard.
It is compatible with soldering stations and reballing tools that use direct heat, making the process faster and more effective.
Compatibility and accessories
The template is compatible with the main soldering stations and reballing tools used in mobile phone repair. It is an essential accessory for technicians working with Samsung Note 5 BGA spare parts and looking to improve the quality and speed of their work.
Benefits
- Improves precision in BGA IC repair.
- Reduces working time in reballing processes.
- Increases the success rate in complex repairs.
- Made by Mlink, a recognised brand in electronic soldering accessories.
With this Samsung Note 5 stencil plate, professional technicians can carry out high-quality repairs, ensuring the device's functionality with a specialised and reliable tool.
- Exclusive compatibility with Samsung Note 5
- Heat-resistant material for reballing processes
- Includes all BGA ICs in a single template
- Ideal for professional electronics repair workshops
- Helps achieve precise BGA chip soldering
Customer Questions & Answers
What materials make up the stencil plate, and what advantages do they offer over other options?
The stencil plate is made from stainless steel, which gives it greater resistance to heat deformation and a longer service life compared with aluminium or brass models. Its rigidity also makes precise positioning easier during reballing.
What are the dimensions, weight and contents included in the box when purchasing this product?
The plate measures approximately 90 mm x 60 mm, has a thickness of 0.12 mm and a total weight of around 20 g. The package generally includes only the stencil plate, with no additional accessories such as bases or solder.
Is any maintenance recommended to extend the service life of the stencil plate?
We recommend cleaning the plate with non-corrosive solvents (for example, isopropyl alcohol) after each use to remove solder paste residue and prevent the apertures from blocking. Abrasive tools are not recommended, as they may damage the edges of the apertures.
What are the main issues when using this stencil, and how can they be avoided?
The most common issues are the stencil shifting during application and blocked apertures. These can be avoided by ensuring the stencil is mechanically secured to the component and by cleaning it properly after each use. Using specific reballing tools also reduces errors.
What is the Samsung Note 5 stencil plate used for?
It is used to make reballing and soldering of the Samsung Note 5 BGA ICs easier, improving repair precision.
Is it compatible with other Samsung models?
No, this stencil plate is designed exclusively for the Samsung Note 5 and is not recommended for other models.
What type of soldering can be done with this template?
It is used for BGA soldering with direct heat, ideal for reballing processes in professional workshops.
What benefits does this template offer for repairs?
It allows precise application of solder balls, reduces repair time and improves the success rate in BGA IC repairs.
Does it include instructions for use?
The product does not include specific instructions, but it is intended for technicians experienced in BGA soldering and reballing.
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