3.69 €
In Stock
Samsung S4 IC stencil plate for BGA soldering - Mlink accessories
Brand: Mlink
3.69€
VAT included (Ex VAT: 3.00 €)
Volume Discounts
| Quantity | Price | Save |
|---|---|---|
| 2+ | 3.54 € | -4% |
| 10+ | 3.36 € | -9% |
| 20+ | 2.95 € | -20% |
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The Samsung S4 IC stencil plate is an essential tool for technicians and professionals dedicated to repairing Samsung S4 mobile devices. Made by Mlink, this BGA soldering stencil is designed to make the reballing process easier, allowing precise and efficient work on the Samsung S4 BGA ICs.
Key features:
- Direct heat stencil that contains all Samsung S4 BGA ICs.
- Durable material that withstands high temperatures during the soldering process.
- Specific design for Samsung S4, ensuring compatibility and precision.
- Ideal for use with soldering stations and BGA reballing tools.
Typical uses:
- Repair and maintenance of Samsung S4 motherboards.
- Reballing BGA chips to restore electrical connections.
- Essential accessory for electronics and mobile repair workshops.
Compatibility: This stencil plate is designed exclusively for the Samsung S4 BGA ICs, guaranteeing a perfect fit and optimal results in the soldering process.
With this stencil, technicians can carry out precise and clean soldering, reducing the risk of damage to components and improving repair efficiency. The Mlink Samsung S4 IC stencil plate is a reliable solution for those looking for quality and precision in their BGA reballing work.
- BGA soldering stencil for Samsung S4
- Compatible with all Samsung S4 BGA ICs
- Heat-resistant material for direct soldering
- Ideal for motherboard repair and maintenance
- Made by Mlink, with professional quality assurance
Customer Questions & Answers
What type of repairs is the Samsung S4 IC stencil plate suitable for?
The stencil plate is designed for the reballing process on Samsung S4 BGA chips, making it easier to replace solder balls on the ICs during motherboard repairs or device recovery.
What are the dimensions, material and approximate weight of the stencil plate?
Generally, these plates are made from stainless steel with a typical thickness of 0.12 mm to 0.15 mm. Their dimensions are usually 90 mm x 90 mm, with an estimated weight of 20 to 30 g. This may vary slightly depending on the manufacturer.
What equipment and solder can I use with this stencil? Is it compatible with standard heat stations?
The plate is compatible with most hot air stations and heat guns used in microelectronics, and it accepts BGA solder paste (typically Sn-Pb or Sn-Ag-Cu). We recommend checking that the stencil size and pad layout match the specific equipment and chip.
How should the stencil be maintained to ensure durability and precision after several uses?
To maintain precision, it should be cleaned with isopropyl alcohol after each use and not bent or subjected to excessive pressure. Careful handling and storage on flat surfaces will extend its service life without affecting the aperture pattern.
How does this stencil plate differ from generic models or those for other phones in terms of precision?
This specific model has an aperture layout designed expressly for the BGA profiles of the chips used in the Samsung S4. Unlike universal stencils, it ensures greater alignment precision and a lower risk of solder bridges, although it is only suitable for the chips included in this model.
What is the Samsung S4 IC stencil plate used for?
It is used to make the reballing and soldering process of BGA ICs in Samsung S4 devices easier, allowing precise repairs.
Is it compatible with other Samsung models?
No, this stencil plate is designed exclusively for the Samsung S4 BGA ICs.
What type of soldering can be done with this stencil?
It is designed for direct heat soldering on BGA ICs.
Who makes this stencil plate?
The Samsung S4 IC stencil plate is made by the Mlink brand.
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