Samsung S6 IC stencil plate - BGA repair reballing template
Brand: Mlink
VAT included (Ex VAT: 3.00 €)
Volume Discounts
| Quantity | Price | Save |
|---|---|---|
| 2+ | 3.54 € | -4% |
| 10+ | 3.36 € | -9% |
| 20+ | 2.95 € | -20% |
The Samsung S6 IC stencil plate is a specialised template designed to make the reballing process and repair of Samsung S6 BGA chips easier. Manufactured by Mlink, this tool is essential for technicians and professionals working on the maintenance and repair of Samsung mobile devices.
Main features:
- Compatibility: Specifically designed for the Samsung S6 BGA chips, ensuring a precise fit and efficient work.
- Direct heat: Allows direct heat application for soldering, making it easier to replace or repair components with high precision.
- Durable material: Built with durable materials that withstand the temperatures required for the soldering process without deforming.
- Professional use: Ideal for repair shops, specialist technicians and enthusiasts looking for professional results in Samsung board repair.
Typical uses:
- BGA chip reballing on Samsung S6 boards.
- Repair and maintenance of internal electronic components.
- Accessory for soldering stations and rework tools.
Compatibility and accessories:
This template is compatible with soldering equipment and tools that use direct heat for the reballing process. It is an essential accessory for those working with Samsung S6 devices and looking to improve efficiency and precision in their repairs.
Note: The product is currently out of stock. Please check availability for future restocks.
- Stencil template for Samsung S6 BGA chips
- Allows direct heat soldering for reballing
- Manufactured by Mlink with durable materials
- Professional tool for repair and maintenance
- Compatible with soldering and rework stations
Customer Questions & Answers
Which Samsung S6 BGA ICs does this stencil plate cover exactly?
The stencil plate includes apertures specifically designed for all the main BGA ICs found in the Samsung S6, such as the CPU, memory, PMIC and other critical chips. We recommend consulting the attached datasheet to verify the detailed list and confirm specific coverage according to the device version.
What is the manufacturing material and thickness of the stencil plate?
The stencil plate is made from stainless steel, which provides good durability and thermal resistance. The typical thickness for this type of stencil ranges from 0.10 mm to 0.15 mm, allowing precise reballing and helping the solder micro-balls pass through evenly.
Does the stencil plate come with accessories such as a support base or frame?
The usual box contents include only the stencil plate. Accessories such as bases, magnetic frames or universal supports must be purchased separately according to the user’s needs.
What is the Samsung S6 IC stencil plate used for?
It is used to make the reballing process and repair of Samsung S6 BGA chips easier using direct heat soldering.
Is it compatible with other Samsung models?
No, this template is specifically designed for Samsung S6 BGA chips.
Is it currently available to buy?
The product is currently out of stock. Please check availability for future restocks.
What tools are needed to use this stencil plate?
A soldering station with direct heat capability and compatible rework tools are required to carry out the reballing process.
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