3.69 €
In Stock
iPhone 4S Stencil Plate for BGA Soldering - Precise Template Mlink
Brand: Mlink
3.69€
VAT included (Ex VAT: 3.00 €)
Volume Discounts
| Quantity | Price | Save |
|---|---|---|
| 2+ | 3.54 € | -4% |
| 10+ | 3.36 € | -9% |
| 20+ | 2.95 € | -20% |
Only 4 left in stock - order soon!
Standard delivery
Fri, May 1 - Tue, May 5
Express delivery
Wed, Apr 29 - Thu, Apr 30
30-day returns
Free returns within 30 days
Secure transaction
Share:
Free Delivery
Shipping from €4.99
Easy Returns
30 day return policy
Secure Payment
100% secure checkout
Quality Guarantee
Original products only
The iPhone 4S Stencil Plate is an essential tool for technicians specialising in Apple device repair, specifically for the iPhone 4S model. This template is designed for the BGA reballing process, allowing precise and even solder application on the device's ICs.
Main features:
- Direct heat template that includes all BGA ICs of the iPhone 4S.
- Made by Mlink, recognised for its quality in soldering station accessories.
- Allows efficient and precise soldering, making chip and integrated component repair easier.
- Compatible exclusively with the iPhone 4S, ensuring a perfect fit.
Typical uses:
- Reballing of BGA chips on the iPhone 4S to restore electrical connections.
- Repair of ICs that require precision in solder application.
- Use in soldering stations and reballing tools for Apple devices.
Compatibility: This stencil plate is designed specifically for the iPhone 4S and is not compatible with other iPhone models or devices.
With this template, repair professionals can ensure high-quality work, reducing the risk of damage and improving efficiency in the soldering process.
- Direct heat template for BGA ICs on the iPhone 4S
- Made by Mlink, specialist in soldering accessories
- Enables reballing and precise BGA chip repair
- Compatible exclusively with iPhone 4S
- Ideal for repair technicians and soldering stations
Customer Questions & Answers
What is the material and thickness of the stencil plate for iPhone 4S, and how does this affect its durability and precision?
This stencil plate is made from stainless steel with a thickness of approximately 0.12 mm, a material chosen for its resistance to warping and high durability through multiple thermal cycles. The thickness helps achieve good precision when applying solder, minimising the risk of leaks or excess solder during the BGA reballing process.
Does the plate include the full range of BGA patterns for the main iPhone 4S ICs?
Yes, this stencil plate integrates the patterns for all the main BGA ICs used in the iPhone 4S, covering the CPU, memory, baseband and power components. We recommend visually checking if there is a very uncommon variant, as the coverage includes the most standard chips for this model.
What temperature and airflow recommendations should be considered when using this stencil in a direct heat process?
The recommended working range is 260–300 °C, with moderate airflow (approx. 20–30 L/min), to achieve proper solder melting without deforming the stencil. Using higher temperatures may affect the shape of the apertures and shorten the service life of the plate.
What type of solder balls (diameter and material) is this stencil compatible with?
The stencil is designed for use with 0.3 mm diameter Sn63/Pb37 solder balls, which match the pitch of most iPhone 4S ICs. You should verify the specific size of the chip being reballed, although in the vast majority of cases 0.3 mm is ideal.
What are the main alignment or deformation issues that can occur, and how can they be avoided?
The main risks are the plate shifting during heat application and deformation due to overheating. It is recommended to secure it firmly and avoid exceeding 320 °C. After several uses, visually inspect the flatness and apertures to rule out damage.
What is the iPhone 4S stencil plate used for?
It is used to make soldering and reballing of the iPhone 4S BGA ICs easier, allowing precise solder application.
Is this stencil plate compatible with other iPhone models?
No, this stencil plate is designed exclusively for the iPhone 4S.
What benefits does using this soldering template offer?
It offers precision in solder application, improves process efficiency and reduces the risk of damage to components.
What type of soldering is done with this stencil plate?
It is used for direct heat BGA soldering on the iPhone 4S ICs.
Who should use this stencil plate?
Technicians specialising in iPhone 4S repair and professionals working with soldering stations and reballing.
Write a customer review
Customers who bought this item also bought
-4%
Samsung Note 4 stencil plate for IC reballing - Mlink professional tool
3.54€
3.69 €
Only 2 left in stock
iPhone 4S Stencil Plate for BGA Soldering - Precise Template Mlink
3.69 €