High-quality lead-free solder balls 0.40mm, 25,000 pcs
Brand: Pmtc
VAT included (Ex VAT: 6.00 €)
Volume Discounts
| Quantity | Price | Save |
|---|---|---|
| 2+ | 7.08 € | -4% |
| 10+ | 6.52 € | -12% |
| 20+ | 6.05 € | -18% |
The lead-free solder balls 0.40mm 25,000 pcs are a specialist product for soldering and BGA reballing work that requires precision and quality. Manufactured by Profound Material Technology (Pmtc) in Taiwan, this container holds 25,000 lead-free solder balls with a diameter of 0.40 mm, ideal for electronic applications and component repair.
Main features:
- Composition: 96.5% tin (Sn), 3.0% silver (Ag), 0.5% copper (Cu), ensuring a high-quality lead-free alloy.
- Uniform ball size: 0.40 mm for precise and efficient soldering.
- Contents: 25,000 pieces per container, enough for multiple applications and projects.
- Manufactured by Pmtc, recognised for its advanced technology in soldering materials.
Typical uses:
- BGA chip reballing and electronic components.
- Soldering with professional stations and tools.
- Repair and maintenance of circuit boards without the risk of lead contamination.
Compatibility: Compatible with most soldering stations and reballing equipment that require 0.40 mm lead-free solder balls. Its composition ensures optimal and long-lasting performance in electronic processes.
Important note: This product is currently out of stock. We recommend checking availability or alternatives in our store so your projects are not interrupted.
- 0.40 mm lead-free solder balls for precise soldering
- 25,000 pieces per container, ideal for multiple uses
- High-quality alloy: 96.5Sn-3.0Ag-0.5Cu
- Made by Pmtc in Taiwan, with advanced technology
- Perfect for BGA reballing and electronic repair
Customer Questions & Answers
What are the exact dimensions and tolerances of the balls included in the jar?
Each ball has a nominal diameter of 0.40 mm. In the industry, the usual tolerance for balls of this type is ±0.02 mm, although the manufacturer does not specify the exact tolerance. The batch contains 25,000 units.
What types of BGA components and stencils are these 0.40 mm balls compatible with?
The 0.40 mm balls are compatible with BGA (Ball Grid Array) chips whose pad spacing is equal to or slightly above 0.40 mm. It is essential to check the component pitch and the reballing stencil to ensure compatibility; this size is standard in some mobile devices and high-density chips.
Do these lead-free solder balls require any specific flux or special recommendation to achieve reliable solder joints?
Yes, we recommend using flux formulated specifically for lead-free processes, as this material requires working temperatures between 217 °C and 222 °C and has lower wettability than leaded solder. A suitable flux helps prevent cold balls and ensures an even solder joint.
How do durability and performance compare with traditional leaded solder balls in repetitive applications?
Lead-free balls usually show slightly higher mechanical strength, but they are also more prone to whisker formation and thermal fatigue under intensive cycling. In environments with large temperature fluctuations, the leaded product (SnPb) may have a marginally longer service life; however, in standard applications, the difference is minimal if the process is properly adjusted.
What is the composition of the solder balls?
The composition is 96.5% tin (Sn), 3.0% silver (Ag) and 0.5% copper (Cu).
What are these lead-free solder balls used for?
They are mainly used for BGA reballing, soldering and lead-free repair of electronic components.
Is this product available for immediate dispatch?
The product is currently out of stock and not available for immediate dispatch.
Is it compatible with any soldering station?
Yes, it is compatible with most soldering stations and reballing equipment that use 0.40 mm lead-free solder balls.
Write a customer review
Customers who bought this item also bought
Your Recently Viewed Items
