Mlink R1 BGA chip reballing station with PID temperature control
Brand: Mlink
VAT included (Ex VAT: 169.00 €)
Volume Discounts
| Quantity | Price | Save |
|---|---|---|
| 2+ | 199.56 € | -4% |
| 10+ | 195.40 € | -6% |
| 20+ | 187.08 € | -10% |
The Mlink R1 BGA chip reballing station is a specialised soldering station for the reballing process of BGA (Ball Grid Array) chips. This tool is ideal for technicians and professionals who require precision and reliability in the repair and maintenance of integrated electronic components.
It features precise temperature control using PID technology, allowing the temperature to be adjusted in a range from 20 to 300 degrees Celsius, ensuring even and safe heating for BGA chips. The station includes two plates: one for heating and another for cooling, making the process efficient and controlled.
Main features:
- Heating area of 120 mm x 200 mm, suitable for various BGA chip sizes.
- 600 W power output that ensures fast and stable heating.
- Adjustable temperature control between 20 and 300 degrees with PID regulation for maximum precision.
- Working time configurable from 0,1 to 9,9 minutes, allowing adaptation to different reballing processes.
- AC220V power supply, compatible with standard installations.
- Compact dimensions: 310 mm long, 280 mm wide and 145 mm high, with a weight of 7,7 kg for easier handling and transport.
This soldering station is compatible with a wide variety of BGA integrated circuits, making it an essential tool for electronics repair workshops and professionals working with high-tech devices.
Typical use of the Mlink R1 includes reballing BGA chips on motherboards, graphics cards, and other electronic devices where it is necessary to replace or repair components soldered under the ball grid array.
Thanks to its robust design and advanced functions, the Mlink R1 delivers professional and reliable results in every reballing operation, optimising time and reducing the risk of damage to components.
- Heating area: 120 mm x 200 mm for a range of BGA chips
- 600 W power for fast, stable heating
- Adjustable PID temperature control between 20 and 300 °C
- Configurable working time from 0,1 to 9,9 minutes
- Standard AC220V power supply
- Dimensions: 310 x 280 x 145 mm and weight of 7,7 kg
- Includes two plates: heating and cooling
Customer Questions & Answers
What are the advantages of having a dedicated cooling plate as well as a heating plate on the Mlink R1?
The dual plate design (heating and cooling) allows better control of the thermal cycle during BGA reballing, minimising thermal stress on the chips and improving reballing quality compared with single-surface equipment. This reduces the risk of micro-cracks and deformation in sensitive components.
What are the dimensions and weight of the Mlink R1, and what exactly is included in the box when buying this product?
The Mlink R1 measures 310 mm long, 280 mm wide and 145 mm high, with a weight of 7.7 kg. The box includes the main unit with the two plates, power cable and user manual. Consumables such as solder balls or stencils are not usually included and must be purchased separately.
Does it require any special mains socket or protection to operate the Mlink R1 safely?
It operates on 220 V AC and consumes up to 600 W. A socket with earth connection is recommended, protected by a residual current device and a suitable fuse (minimum 5 A). It is not compatible with 110 V networks without a transformer.
What are the temperature limits and PID control accuracy for demanding reballing work?
The Mlink R1 allows the temperature to be adjusted from 20 °C to 300 °C with PID control, offering typical accuracy of ±2 °C under stable conditions. This range covers most leaded and lead-free solder reballing processes, but for special alloys outside this range, additional verification with an external thermocouple is recommended.
What maintenance does the Mlink R1 require and what is its estimated lifespan in a professional workshop?
Basic maintenance involves regular cleaning of the plates, mechanical checking of electrical contacts and annual calibration of the temperature sensor. Typical lifespan is over 3 years in frequent professional use, although components such as sensors or heating elements may need replacing depending on use and maintenance.
What is the Mlink R1 BGA chip reballing station used for?
It is used for BGA chip reballing, allowing integrated circuits to be soldered or repaired with precise temperature control.
What temperature range can it reach?
The Mlink R1 can adjust the temperature from 20 to 300 degrees Celsius with PID control.
What heating area does it have?
It has a heating area of 120 mm by 200 mm, suitable for different BGA chip sizes.
Is it compatible with a standard power supply?
Yes, it works with a standard AC220V power supply.
Is it currently available to buy?
The product is currently out of stock. It is recommended to check availability or look for alternatives.
Write a customer review
Customers who bought this item also bought
Professional Mlink H4 2-in-1 soldering station pack and Mlink 853a preheater
Mlink LCD3 LCD screen separator station for iPhone 4/4S/5/5S/5C and Galaxy S3 S4
Your Recently Viewed Items
