0.55mm Leaded Solder Balls Jar 250,000 pcs for BGA Soldering

Product description:

The 0.55mm leaded solder balls jar 250,000 pcs is an essential accessory for electronics soldering work, especially in BGA reballing processes. This PMTC brand product offers a 63Sn 37Pb alloy composition that ensures efficient and reliable soldering.

Main features:

• Ball diameter: 0.55 mm, ideal for precise soldering on small electronic components.
• Quantity: 250,000 units per jar, enough for multiple professional applications.
• Composition: 63% tin (Sn) and 37% lead (Pb), a classic leaded solder mix that provides good flow and strength.
• Manufactured by Profound Material Technology (PMTC) in Taiwan, ensuring quality and consistency.

Typical uses:

• BGA (Ball Grid Array) reballing and chip repair.
• Soldering electronic components on printed circuit boards.
• Maintenance and repair of electronic devices that require leaded soldering.

Compatibility:

This product is compatible with soldering stations and standard reballing tools used in professional electronics. Its size and composition make it suitable for work that requires precision and quality in leaded soldering.

Additional benefits:

• Provides uniform and reliable soldering.
• Makes it easier to work on high pin-density components.
• The jar allows safe and convenient storage of the material.

This jar of leaded solder balls is an essential consumable for technicians and electronics repair professionals looking for quality and performance in their soldering processes.

• Ball diameter: 0.55 mm for precise soldering
• Quantity: 250,000 pcs per jar
• Composition: 63% tin (Sn) and 37% lead (Pb)
• Manufactured by PMTC in Taiwan
• Ideal for BGA reballing and repair
• Compatible with standard soldering stations
• Provides uniform and reliable soldering