Jar of lead-free solder balls 0,30mm 250,000 units for BGA reballing

The jar of 0,30 mm lead-free solder balls with 250,000 units is the go-to consumable for BGA reballing and electronics repair. The large format is significantly more cost-effective than the small jar if you work with it daily.

Specifications

• Diameter: 0,30 mm.
• Quantity: 250,000 balls per jar.
• Alloy: Sn96.5Ag3.0Cu0.5 — 96.5% tin (Sn), 3.0% silver (Ag) and 0.5% copper (Cu).
• Melting point: 217-220 °C.
• Manufacturer: Profound Material Technology (PMTC).
• Shelf life: 1 year from the manufacturing date printed on the jar.
• Identification: green lid, with the size indicated on the top label.

Compliant with RoHS regulations, making it the required choice when the repaired device must remain lead-free.

Applications

BGA chip reballing, repair of console, mobile phone, laptop and graphics card boards, and any work that requires rebuilding the solder balls on an IC. Applied using a stencil matched to the corresponding pitch and flux.

Choosing the right size

The size is determined by the pitch of the chip you are working on, not personal preference: a ball that is too large causes bridges between pads, and one that is too small will not make proper contact. If you work with several different ICs, it is worth keeping two or three diameters on hand.

Storage

Keep the jar tightly closed, in a dry place away from sudden temperature changes. Oxidised balls wet poorly and cause cold joints, so avoid leaving the jar open any longer than necessary.