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0.65mm lead-free solder balls 250,000 pcs for soldering

Brand: Pmtc

43.05

VAT included (Ex VAT: 35.00 €)

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Product description:
This container holds 250,000 lead-free solder balls with a diameter of 0.65 mm, ideal for electronic soldering and reballing processes. Manufactured by Profound Material Technology (PMTC) in Taiwan, these balls offer a high-quality composition of 96.5% tin (Sn), 3.0% silver (Ag) and 0.5% copper (Cu), ensuring optimum performance in electronic applications.

Main features:

  • Ball diameter: 0.65 mm.
  • Quantity: 250,000 units per container.
  • Composition: 96.5% Sn, 3.0% Ag, 0.5% Cu.
  • Lead-free, complying with environmental regulations.
  • Manufactured by Profound Material Technology (PMTC), Taiwan.

Uses and applications:
These lead-free solder balls are ideal for BGA component reballing and other fine soldering applications in electronics. Their size and composition ensure precise and reliable soldering on printed circuit boards and electronic devices.

Compatibility:
Perfect for soldering stations and reballing tools that require lead-free material, helping with electronic repair and manufacturing in line with modern standards.

Additional benefits:

  • Lead-free material for a safer, more environmentally friendly process.
  • High quality and purity guaranteed by PMTC.
  • Supplied in a container for easy storage and controlled use.

This product is a reliable solution for electronics professionals and hobbyists looking for quality and environmental compliance in their soldering materials.

  • 250,000 lead-free solder balls with a 0.65 mm diameter
  • Composition: 96.5% tin, 3.0% silver, 0.5% copper
  • Ideal for electronic soldering and BGA reballing
  • Manufactured by Profound Material Technology (PMTC) in Taiwan
  • Lead-free product, environmentally friendly

Customer Questions & Answers

What types of alloys and fluxes are these lead-free solder balls compatible with?

These balls are compatible with fluxes designed for SnAgCu alloys and can be used with most lead-free pastes and solders in line with the 96.5Sn-3.0Ag-0.5Cu composition; they are not recommended for use with lead-based solders, as this may affect the strength and reliability of the assembly.

What is the recommended working temperature for using these lead-free solder balls during soldering?

The melting point of the 96.5Sn-3.0Ag-0.5Cu alloy is approximately 217-221 °C, so a soldering temperature of 235-250 °C is recommended depending on the thermal profile of the process and the sensitivity of the components.

Is there any significant difference in durability or reliability compared with leaded solder balls, especially in prolonged thermal cycling?

Lead-free balls may be somewhat more prone to crack formation from fatigue under prolonged thermal cycling compared with leaded ones, especially in high-vibration applications; however, they meet industrial standards and offer good reliability within the recommended operating ranges.

What is the composition of the lead-free solder ball container?

The composition is 96.5% tin (Sn), 3.0% silver (Ag) and 0.5% copper (Cu).

What applications is this product suitable for?

It is ideal for electronic soldering, especially BGA component reballing and fine soldering work on printed circuit boards.

Does this product contain lead?

No, this container contains lead-free solder balls, complying with environmental regulations.

What is the diameter of the solder balls?

Each ball has a diameter of 0.65 mm.

Who manufactures this product?

The product is manufactured by Profound Material Technology (PMTC), based in Taiwan.

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