18.45 €
In Stock
Lead solder balls 0.5mm 250,000 pcs for professional soldering
Brand: Pmtc
18.45€
VAT included (Ex VAT: 15.00 €)
Volume Discounts
| Quantity | Price | Save |
|---|---|---|
| 2+ | 17.71 € | -4% |
| 10+ | 17.16 € | -7% |
| 20+ | 15.31 € | -17% |
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The lead solder balls 0,5mm 250.000 ud are an essential product for soldering professionals and BGA reballing specialists who require precision and quality in their work. Manufactured by Profound Material Technology (Pmtc) in Taiwan, this container holds 0.5 mm diameter lead solder balls, ideal for electronics applications and component repair.
Main features:
- Composition: 63% tin (Sn) and 37% lead (Pb), a classic solder alloy with excellent flow and adhesion.
- Ball diameter: 0.5 mm, suitable for fine soldering work and BGA chip reballing.
- Quantity: 250.000 units per container, providing an abundant supply for multiple projects.
- Manufacturer: Profound Material Technology, recognised for its quality in soldering materials.
- Origin: Made in Taiwan, ensuring high production standards.
Typical uses:
- BGA component reballing on electronic boards.
- Precision soldering in electronics, especially where leaded material is required for better conductivity and mechanical strength.
- Repair and maintenance of electronic devices that require reliable and durable solder joints.
Compatibility: This tin ball container is compatible with standard soldering stations and reballing tools on the market, making it easy to integrate into professional processes.
Thanks to their composition and size, these lead solder balls are ideal for technicians and professionals looking for optimal results in precision soldering. The lead in the alloy improves flow and lowers the melting point, making it easier to work with delicate components.
For correct use, it is recommended to handle with care and follow the applicable safety regulations when working with materials containing lead.
- 63Sn 37Pb composition for high-quality lead soldering
- 0.5 mm ball diameter for precision BGA reballing
- 250,000 pieces per container for long-lasting use
- Manufactured by Profound Material Technology (Pmtc) in Taiwan
- Ideal for professional soldering and electronics repair
Customer Questions & Answers
What is the exact ratio and type of alloy used in these leaded solder balls, and why is it relevant for BGA soldering processes?
The alloy is 63% tin (Sn) and 37% lead (Pb), known as Sn63Pb37, with a melting point of 183 °C. This ratio ensures excellent wetting and joint formation, which is critical in BGA work due to the precision and reliability required for these reballs, and it is the standard formula in traditional electronics.
What are the exact dimensions of each ball and the maximum permitted diameter variation from the manufacturer?
Each ball has a diameter of 0.5 mm. The manufacturer does not specify the exact tolerance, but in the industry a deviation of ±0.02 mm is usually accepted for balls of this type. We recommend checking visually or mechanically if greater precision is required.
Which types of stencils and reballing processes are these 0.5 mm balls compatible with?
They are compatible with steel or polymer stencils designed for 0.5 mm BGA balls. Suitable for both manual and automatic reballing on standard BGA rework stations. They are not suitable for packages requiring a different ball diameter.
Due to the lead content, what safety precautions and regulations apply to the use, handling and disposal of these balls?
Lead requires handling in ventilated areas, the use of gloves and hand washing after contact. Their use is restricted in the EU under RoHS except for industrial exemptions, and they must be disposed of as hazardous waste in accordance with local regulations. They are not suitable for products intended for general consumer use in RoHS territories.
Are there any fundamental functional differences between these Sn63Pb37 balls and lead-free alternatives (for example, Sn96.5Ag3Cu0.5) in terms of application and durability?
Sn63Pb37 balls have a lower melting point and greater ductility than lead-free alternatives such as Sn96.5Ag3Cu0.5, making them easier to work with and reducing thermal stress. However, lead-free options offer greater mechanical strength and comply with RoHS; the choice depends on the regulatory and reliability requirements of the final product.
What is the composition of the solder balls?
The balls are made of an alloy of 63% tin (Sn) and 37% lead (Pb).
What type of soldering is this product suitable for?
It is suitable for precision soldering, especially BGA component reballing and electronic work that requires lead.
How many balls does the container hold?
The container holds 250,000 lead solder balls with a diameter of 0.5 mm.
Who manufactures this product?
The product is manufactured by Profound Material Technology (Pmtc), in Taiwan.
Is it compatible with common soldering stations?
Yes, it is compatible with standard soldering stations and reballing tools on the market.
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Lead solder balls 0.5mm 250,000 pcs for professional soldering
18.45 €