Leaded solder balls 0,30mm 250,000 units for BGA reballing

The 0,30 mm leaded solder ball tub with 250,000 units is the go-to consumable for BGA reballing and electronics repair. The large format is far more cost-effective than the small tub if you work with it daily.

Specifications

• Diameter: 0,30 mm.
• Quantity: 250,000 balls per tub.
• Alloy: Sn63Pb37 — 63% tin (Sn) and 37% lead (Pb).
• Melting point: 183 °C.
• Manufacturer: Profound Material Technology (PMTC).
• Shelf life: 1 year from the manufacturing date printed on the tub.
• Identification: white cap, with the size indicated on the top label.

This is the classic eutectic alloy: it melts at a lower temperature than lead-free alternatives, which reduces thermal stress on the board and makes manual work easier.

Applications

BGA chip reballing, repair of console, mobile, laptop and graphics card boards, and any job that requires rebuilding the solder balls on an integrated circuit. Applied using a stencil matched to the relevant pitch, together with flux.

Choosing the right size

The size is determined by the pitch of the chip you are working on, not personal preference: a ball that is too large causes bridges between pads, while one that is too small will fail to make contact. If you work with several different integrated circuits, it is worth keeping two or three diameters on hand.

Storage

Keep the tub tightly closed, in a dry place away from sudden temperature changes. Oxidised balls wet poorly and produce cold joints, so avoid leaving the tub open any longer than necessary.