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Shuttle Star BGA nozzle 44x44 mm mod v1y v2 for soldering station

Brand: Shuttle Star

18.45

VAT included (Ex VAT: 15.00 €)

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2+ 17.71 € -4%
10+ 17.16 € -7%
20+ 15.31 € -17%
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Shuttle Star BGA nozzle 44 x 44 mm mod v1y v2 is a specialised component designed for soldering and reballing stations that require precision when handling BGA (Ball Grid Array) chips.

This spare part is compatible with mod v1y and v2 versions, ensuring a perfect fit and optimum performance in repairs and electronic component soldering processes.

  • Dimensions: 44 x 44 mm, suitable for standard-size BGA chips.
  • Compatibility: Designed for Shuttle Star mod v1y and v2 soldering stations.
  • Use: Ideal for BGA reballing and soldering work, providing controlled and precise airflow.
  • Material: Made from heat-resistant materials to withstand high temperatures during the soldering process.

This spare part is essential for technicians looking to maintain or improve the efficiency of their BGA soldering stations, making it easier to repair and maintain electronic boards with BGA components.

Important note: This product is currently out of stock. We recommend checking with our team for restock dates or available alternatives.

  • 44 x 44 mm dimensions, ideal for standard BGA chips
  • Compatible with Shuttle Star mod v1y and v2 stations
  • Heat-resistant material for high durability
  • Designed for BGA soldering and reballing work
  • Precise airflow for high-quality soldering

Customer Questions & Answers

Which soldering station models is this nozzle compatible with?

It is compatible with Shuttle Star mod v1y and v2 stations, designed for work with BGA chips.

Can I use this nozzle for other BGA chip sizes?

This nozzle is specifically designed for 44 x 44 mm BGA chips, so it is not recommended for other sizes.

Is it currently available to buy?

The product is currently out of stock. You can check with the seller for restock dates or alternatives.

What material is the nozzle made from?

It is made from heat-resistant materials to ensure durability during soldering processes.

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