0.5mm Leaded Solder Balls Jar, 25,000 Pieces for BGA
Brand: Pmtc
VAT included (Ex VAT: 4.00 €)
Volume Discounts
| Quantity | Price | Save |
|---|---|---|
| 2+ | 4.72 € | -4% |
| 10+ | 4.48 € | -9% |
| 20+ | 3.94 € | -20% |
The 0.5mm leaded solder balls jar, 25,000 pcs is a specialist product designed for professionals who require precision in electronic soldering processes, especially in BGA reballing applications. Manufactured by Profound Material Tecnology in Taiwan, this product guarantees quality and reliability in every solder ball.
Main features:
- Composition: 63% tin (Sn) and 37% lead (Pb), a classic alloy for soldering with excellent melting and adhesion properties.
- Size: 0.5mm diameter balls, ideal for precision work on small electronic components.
- Quantity: 25,000 units per jar, enough for multiple applications and projects.
- Manufacturer: Profound Material Tecnology, recognised for its quality in soldering materials.
- Origin: Taiwan, ensuring high manufacturing standards.
Typical uses:
- BGA reballing: Perfect for repairing and maintaining BGA chips by replacing solder balls.
- Precision electronic soldering: Ideal for work on printed circuit boards and delicate components.
- Electronics projects that require leaded soldering to ensure durable and reliable connections.
Compatibility: Compatible with soldering stations and standard reballing tools that support 0.5mm leaded solder balls.
This leaded solder balls jar not only offers a practical solution for professional and hobbyist solderers, but also ensures a high-quality finish on your electronic projects. Due to its composition and size, it is especially recommended for work that requires precision and reliability.
Note: This product is currently out of stock. We recommend checking availability or contacting our customer service for future restocks.
- 63Sn 37Pb composition for high-quality soldering
- 0.5mm solder balls for precision work
- 25,000 pieces per jar
- Manufactured by Profound Material Tecnology in Taiwan
- Ideal for BGA reballing and electronic soldering
Customer Questions & Answers
What is the exact composition of the leaded solder balls, and for what type of soldering are they most recommended?
The balls have a composition of 63% tin (Sn) and 37% lead (Pb), known as eutectic. This alloy is ideal for BGA (Ball Grid Array) soldering in electronics, as it offers a controlled melting temperature (183 °C), good flow and a lower risk of defects caused by thermal expansion.
What are the dimensions and diameter tolerance of each ball, and how many pieces does the jar include?
Each ball has a nominal diameter of 0.5 mm. The usual tolerance for balls of this type is ±0.02 mm, although this may vary by batch. The jar contains 25,000 units according to the manufacturer’s specification.
Are these leaded solder balls compatible with standard reballing stations and universal stencils?
Yes, the 0.5 mm diameter is a standard format used in BGA component reballing, compatible with most stations and stencils designed for that size. It is important to check that the stencil used is specifically for 0.5 mm to ensure good alignment.
What safety precautions should I take when handling leaded solder balls, and do they comply with any regulations?
As they contain lead, we recommend using gloves and a mask during handling, and a fume extraction system during soldering. These balls do not comply with RoHS directives, which restrict lead in Europe. They are not suitable for applications where lead-free soldering is required by regulations.
What practical difference is there in joint durability and ease of use compared with lead-free balls?
63/37 balls offer better wetting and less whisker formation than lead-free alloys. Their lower melting point makes the process easier and reduces thermal stress on components, although the lead content involves regulatory limitations and toxicological risks.
What is the 0.5mm leaded solder balls jar used for?
It is designed for precision electronic soldering, especially for BGA reballing and chip repair using solder balls.
What is the composition of the solder balls?
The composition is 63% tin (Sn) and 37% lead (Pb), a standard alloy for leaded soldering.
How many balls are in the jar?
The jar contains 25,000 leaded solder balls with a diameter of 0.5mm.
Is it compatible with any soldering station?
Yes, it is compatible with soldering stations and reballing tools that support 0.5mm leaded solder balls.
Is the product available?
The product is currently out of stock. You can check future availability with customer service.
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