Lead-free solder balls 0.20mm, 25,000 pcs for precise soldering
Brand: Pmtc
VAT included (Ex VAT: 6.00 €)
Volume Discounts
| Quantity | Price | Save |
|---|---|---|
| 2+ | 7.08 € | -4% |
| 10+ | 6.52 € | -12% |
| 20+ | 6.05 € | -18% |
The 0.20mm lead-free solder balls jar is an essential product for professionals and hobbyists in soldering who require precision and quality in their work. This jar contains 25,000 lead-free solder balls, with a diameter of 0.20 mm, making it perfect for fine soldering applications, especially in BGA reballing processes.
Key features:
- Composition: 96.5% tin (Sn), 3.0% silver (Ag), 0.5% copper (Cu), ensuring a strong and reliable solder joint.
- Diameter: 0.20 mm, ideal for precision soldering work.
- Quantity: 25,000 pieces per jar, enough for multiple projects.
- Lead-free: Complies with environmental and safety regulations, avoiding the risks associated with lead.
- Manufacturer: Profound Material Technology, recognised for its quality and advanced technology, made in Taiwan.
Typical uses:
This lead-free solder balls jar is especially suitable for:
- BGA chip reballing in electronics.
- Soldering delicate electronic components.
- Repair and assembly projects for printed circuit boards.
Compatibility:
Compatible with standard soldering stations and reballing tools. Its lead-free composition makes it suitable for applications that need to comply with RoHS and other environmental regulations.
This product is currently out of stock, but can be reserved for future purchases. Its high quality and technical specifications make it a reliable choice for professional electronics work.
- 25,000 lead-free solder balls with a 0.20 mm diameter
- Composition: 96.5% Sn, 3.0% Ag, 0.5% Cu for strong soldering
- Ideal for BGA reballing and precision soldering
- Made by Profound Material Technology in Taiwan
- Meets environmental regulations as a lead-free product
Customer Questions & Answers
What is the 0.20mm lead-free solder balls jar used for?
It is mainly used for precision soldering and BGA reballing processes in electronic components.
What is the composition of the solder in this product?
The composition is 96.5% tin (Sn), 3.0% silver (Ag) and 0.5% copper (Cu).
Is this product suitable for lead-free soldering?
Yes, it is a lead-free product, ideal for meeting environmental and safety regulations.
How many solder balls does the jar contain?
It contains 25,000 solder balls with a diameter of 0.20 mm.
Is it currently available to buy?
The product is currently out of stock, but it can be reserved for future purchases.
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