0.6mm Leaded Solder Balls Jar, 25,000 pcs for Soldering
Brand: Pmtc
VAT included (Ex VAT: 4.50 €)
Volume Discounts
| Quantity | Price | Save |
|---|---|---|
| 2+ | 5.31 € | -4% |
| 10+ | 5.04 € | -9% |
| 20+ | 4.43 € | -20% |
Product description
The 0.6mm leaded solder balls jar, 25,000 pcs is an essential accessory for electronics soldering professionals and hobbyists who require precision and quality in their work. Manufactured by Profound Material Tecnology (Pmtc) in Taiwan, this product offers an optimal composition of 63% tin (Sn) and 37% lead (Pb), ideal for soldering and reballing processes on electronic components.
Main features:
- Ball diameter: 0.6 mm, suitable for fine and precise soldering.
- Quantity: 25,000 pieces per jar, enough for multiple projects and repairs.
- Composition: 63Sn 37Pb, a traditional leaded solder mix that ensures good flow and mechanical strength.
- Brand: Pmtc, recognised for its quality in soldering materials.
- Manufacture: Profound Material Tecnology, Taiwan, guaranteeing high quality and process control in production.
Uses and applications:
These leaded solder balls are ideal for:
- Reballing BGA chips and other electronic components.
- Precision soldering on printed circuit boards and delicate components.
- Repair and maintenance of electronic devices that require reliable solder joints.
Compatibility:
This product is compatible with soldering stations and reballing tools that work with 0.6 mm solder balls. It is especially useful for technicians and professionals looking for precise and durable results in leaded soldering.
Considerations:
- Product currently out of stock; please check availability before purchase.
- Use of leaded solder should be carried out in accordance with the relevant regulations and precautions for handling lead-containing materials.
With this jar of leaded solder balls, you get a high-quality soldering material that makes precision work easier and delivers professional results in your electronics projects.
- 25,000 leaded solder balls with a 0.6 mm diameter
- 63Sn 37Pb composition for traditional soldering
- Manufactured by Profound Material Tecnology (Pmtc) in Taiwan
- Ideal for reballing and precision soldering
- Compatible with soldering stations and reballing tools
Customer Questions & Answers
What is the exact composition of the tin balls, and what advantages does the 63Sn/37Pb alloy offer in electronic soldering applications?
The composition is 63% tin (Sn) and 37% lead (Pb), known as eutectic. This alloy melts at 183°C, offering a precise solid-to-liquid transition, which reduces defects such as solder bridges or weak joints in BGA reballing compared with lead-free alloys that require higher temperatures.
What safety considerations should be taken when handling lead solder balls, and what regulations govern them?
Lead is toxic if ingested or inhaled as dust; wearing gloves and working in well-ventilated areas is recommended. The use of lead-containing products is regulated by standards such as RoHS in the EU, and is permitted in industrial applications or specific repairs, but not for new consumer devices.
Are 0.6 mm balls compatible with all BGA packages, or are there usage limitations?
A 0.6 mm ball diameter is standard for many medium-pitch BGA packages, but it is not compatible with all of them. The component datasheet should always be checked to ensure it matches the pitch and pad size. If the ball is too large or too small, it can cause alignment or reliability issues.
Are there performance or application differences compared with lead-free solder balls of a similar diameter?
Lead-containing balls have a lower melting point (183°C versus 217–221°C for lead-free), which reduces thermal stress on components and PCBs. However, lead-free balls (e.g. SAC305) may be required for compliance. Lead-containing balls are recommended for replicas or repairs on legacy equipment, due to their easier soldering and better resistance to thermal cycling.
What is the composition of the 0.6mm leaded solder balls jar?
The composition is 63% tin (Sn) and 37% lead (Pb), ideal for traditional soldering.
What are these solder balls used for?
They are used for electronics soldering, especially BGA chip reballing and precision work.
How many balls are in the jar?
The jar contains 25,000 leaded solder balls with a 0.6 mm diameter.
Is it compatible with any soldering station?
Yes, it is compatible with soldering stations and tools that work with 0.6 mm solder balls.
Is the product available for immediate dispatch?
The product is currently out of stock, so it is recommended to check availability before placing an order.
Write a customer review
Customers who bought this item also bought
