146.37 €
In Stock
8-Piece Universal Stencil Set 90mmx90mm Mk-15/Ht90 with 230 templates
Brand: Mlink
146.37€
VAT included (Ex VAT: 119.00 €)
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| Quantity | Price | Save |
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| 2+ | 140.52 € | -4% |
| 10+ | 137.59 € | -6% |
| 20+ | 131.73 € | -10% |
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The 8-Piece Universal Stencil Set 90mmx90mm Mk-15/Ht90 is a professional set designed to make soldering and reballing BGA (Ball Grid Array) electronic components easier. This set includes 230 high-precision templates, with a standard size of 90x90 mm, allowing precise solder application on chips from different brands and models.
Main features:
- Universal stencil size: 90mm x 90mm, suitable for a wide range of chips.
- Includes 230 stencils for different ICs, including Intel, AMD, ATI, NVIDIA, Xbox, PS3 and more.
- Compatible with DDR1, DDR2, DDR3 and DDR5 memory, making repairs easier on various devices.
- Designed for reballing and BGA soldering work, ensuring precision and quality in every application.
- Durable material that ensures long service life and reuse across multiple projects.
Typical uses:
- Repair and maintenance of motherboards and graphics cards.
- Reballing of Intel, AMD, ATI and NVIDIA chips to restore electrical connections.
- Precise soldering on electronic components for devices such as Xbox 360, PS3 and WII.
- Use in electronics workshops and specialised technical service centres.
Compatibility:
This set is compatible with a wide range of chips and components, including but not limited to:
- Intel: 82801 IUX, BD82HM65, BD82HM550, BD82P55, I7-620M, LGA1155, LGA1156, LGA1366, among others.
- AMD/ATI: 216MQA6AVA12FG, M64-M, M74-M, HD4570, XP600, SB700, RS800ME, X1300, X1600, X1700, and more.
- NVIDIA: MCP67MV-A2, NF-6100-430, GF104-325-A1, GF100-030-A3, FX5700, FX5900, and other popular models.
- DDR1, DDR2, DDR3 and DDR5 memory for various repair applications.
- Consoles and devices: Xbox 360 CPU/GPU, PS3 GPU/CPU, WII GPU/CPU.
This set is an essential tool for technicians and professionals who require precision and versatility in BGA soldering and reballing work. Its universal design and broad compatibility with chips and memory make it an indispensable product for advanced electronics maintenance.
- 8-piece set of universal 90x90 mm stencils for BGA soldering and reballing.
- Includes 230 stencils compatible with Intel, AMD, ATI, NVIDIA, Xbox and PS3 chips.
- Compatible with DDR1, DDR2, DDR3 and DDR5 memory for a range of applications.
- Durable, reusable material for multiple uses in electronics workshops.
- Ideal for professional repair of motherboards, graphics cards and consoles.
Customer Questions & Answers
What are the main benefits of the 8-piece universal 90 mm x 90 mm stencil set compared with other IC reballing kits?
This set provides 8 universal 90 mm x 90 mm templates compatible with more than 230 different chips, including Intel, AMD, ATI and DDR memory ICs, covering a wide range of models used in laptops and consoles. Its main advantage over dedicated kits is versatility: it covers more references with one set, reducing the need to buy multiple individual templates.
What material are the stencils made from, and what is their approximate thickness?
The stencils are typically made from high-precision stainless steel, with a standard thickness of 0.12 mm to 0.15 mm. This range ensures durability and proper heat transfer during the soldering process, as well as resistance to deformation under regular use.
Are there any important compatibility or technical limitations regarding BGA ball size or pitch that could affect the usefulness of the set?
The set is mainly optimised for BGA arrays with a standard ball pitch between 0.5 mm and 0.75 mm, which are the most common in laptops and consoles. It is not suitable for packages with a different pitch (larger or smaller), or for ultra-miniature chips; specific templates would be required in those cases.
Does these stencils require any special care to preserve the accuracy of the apertures?
Yes, it is recommended to clean the stencils after each use with isopropyl alcohol and store them flat and protected from moisture. Contact with sharp tools or abrasive cleaning can degrade the apertures, affecting reballing quality.
What is the key difference between this universal set and one dedicated only to iPhone models or DDR memory?
A universal set like this covers multiple platforms (Intel, AMD, ATI, DDR and some iPhone models), allowing use across different types of equipment, whereas a dedicated set is optimised only for a specific IC family, resulting in greater precision but less flexibility. The choice depends on the volume and variety of repairs expected.
What is the 8-Piece Universal Stencil Set 90mmx90mm Mk-15/Ht90 used for?
This set is used to make soldering and reballing BGA electronic components easier, allowing solder to be applied precisely to chips from different brands and models.
Which chips is this stencil set compatible with?
It is compatible with a wide variety of Intel, AMD, ATI and NVIDIA chips, as well as DDR1, DDR2, DDR3 and DDR5 memory, and consoles such as Xbox 360, PS3 and WII.
What size are the included stencils?
The stencils are a universal size of 90mm x 90mm, suitable for most BGA chips.
Is this set reusable?
Yes, the stencils are made from durable materials that allow them to be reused across multiple soldering and reballing projects.
Where can I use this set?
It is ideal for electronics repair workshops, technical service centres and professionals working with BGA soldering and reballing.
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