3.69 €
In Stock
iPhone 5 IC Stencil Plate for BGA Reballing with Direct Heat
Brand: Mlink
3.69€
VAT included (Ex VAT: 3.00 €)
Volume Discounts
| Quantity | Price | Save |
|---|---|---|
| 2+ | 3.54 € | -4% |
| 10+ | 3.36 € | -9% |
| 20+ | 2.95 € | -20% |
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The iPhone 5 IC Stencil Plate is an essential tool for technicians and professionals carrying out BGA component repairs on the iPhone 5. This stencil plate allows direct heat to be applied precisely to BGA ICs, making the reballing process easier and ensuring a quality solder joint.
Main features:
- Template designed specifically for all BGA ICs on the iPhone 5.
- Allows direct heat to be applied for efficient and safe reballing.
- Made from durable materials to withstand high temperatures.
- Compatible with soldering stations and repair tools for iPhone 5.
Typical uses:
- Repair and maintenance of iPhone 5 motherboards.
- BGA chip reballing to restore damaged connections.
- Support for electronic soldering work on mobile devices.
This stencil plate is a key accessory within iPhone 5 soldering accessories and repair tools, helping to improve precision and efficiency in the reballing process. Its specific design for the iPhone 5 ensures full compatibility with its BGA components, preventing damage and improving repair quality.
For best results, it is recommended to use this template together with soldering stations and equipment specialised in smartphone repair.
- Template for BGA reballing including all iPhone 5 ICs
- Allows direct heat application for precise soldering
- Heat-resistant material
- Compatible with iPhone 5 soldering tools and stations
- Ideal for iPhone 5 motherboard repair and maintenance
Customer Questions & Answers
What materials make up the IC stencil plate for iPhone 5, and what is its thickness?
The IC stencil plate for iPhone 5 is generally made from high-quality stainless steel to withstand soldering temperatures without warping, with a typical thickness of 0.12 mm to 0.15 mm, suitable for direct-heat BGA applications.
Is this stencil compatible with standard hot air soldering stations, and is there a risk of heat deformation?
The plate is compatible with most hot air soldering stations (temperatures between 250 °C and 350 °C). Its steel is designed to resist deformation during normal use, although excessive overheating or localised heating can cause slight warping.
Is additional fixing or a specific support required during the soldering process to ensure precise IC alignment?
To achieve precise BGA chip alignment, we recommend using magnetic bases, heat-resistant tape or specific supports to help secure the stencil and PCB. It is not strictly necessary, but it significantly improves accuracy and reduces the risk of errors.
How does this stencil differ from universal models, and what are its advantages for the iPhone 5?
Unlike universal stencils, this model is designed exclusively for the iPhone 5 BGA ICs, ensuring high precision in solder ball alignment and reducing the risk of incompatibilities or common repair errors.
What is the estimated service life of the stencil under regular use, and what care should be taken to maximise it?
Under regular use and with proper cleaning after each session (for example, with isopropyl alcohol to remove solder residue), service life can exceed 300 cycles without significant loss of precision. Avoid bending it and using abrasive tools.
What is the iPhone 5 IC stencil plate used for?
It is used for BGA reballing by applying direct heat to the iPhone 5 ICs, making motherboard repair easier.
Is it compatible with other iPhone models?
No, this stencil plate is designed exclusively for the BGA ICs of the iPhone 5.
What type of heat is used with this template?
Direct heat is used to melt the solder during the reballing process.
Can I use it with any soldering station?
It is compatible with soldering stations and specialised tools for iPhone 5 repair.
Does it include all the BGA ICs for the iPhone 5?
Yes, it contains templates for all the BGA ICs of the iPhone 5.
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