3.69 €
In Stock
iPhone 5C IC stencil plate for BGA reballing by Mlink
Brand: Mlink
3.69€
VAT included (Ex VAT: 3.00 €)
Volume Discounts
| Quantity | Price | Save |
|---|---|---|
| 2+ | 3.54 € | -4% |
| 10+ | 3.36 € | -9% |
| 20+ | 2.95 € | -20% |
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The iPhone 5C IC stencil plate is an essential tool for technicians and professionals in mobile device repair, especially for the iPhone 5C. Manufactured by Mlink, this direct-heat template is designed to make the BGA reballing process easier, ensuring precise and efficient soldering of the device's ICs.
Main features:
- Specific design for iPhone 5C that includes all BGA ICs.
- Direct-heat template that allows even heat application during the soldering process.
- Durable, hard-wearing material that withstands multiple uses in repair workshops.
- Compatible with soldering stations and BGA reballing tools.
Technical specifications:
- Type: Stencil template for BGA reballing
- Compatible model: iPhone 5C
- Brand: Mlink
- Use: Repair and maintenance of boards with BGA ICs
Typical uses:
- Repair of iPhone 5C motherboards with issues in BGA ICs.
- Reballing to restore solder connections in electronic components.
- Professional maintenance in electronics repair workshops.
Compatibility: This stencil plate is specifically designed for the iPhone 5C and is not recommended for use with other models to ensure reballing accuracy and effectiveness.
With this template, technicians can carry out repairs with greater precision and reduce the risk of damage to the iPhone 5C's electronic components. It is an essential accessory for those working on Apple device repairs and looking for professional results.
- Direct-heat template for iPhone 5C BGA ICs
- Compatible with soldering stations and BGA reballing tools
- Durable material for repeated use in repair workshops
- Mlink brand, recognised in soldering accessories
- Ideal for professional repairs and iPhone 5C maintenance
Customer Questions & Answers
What is the direct-heat stencil plate for iPhone 5C used for, and what benefits does it offer over traditional reballing methods?
The direct-heat stencil plate for iPhone 5C allows solder balls to be aligned and soldered onto the device’s BGA ICs quickly and accurately. Compared with traditional methods, it improves reballing consistency and reduces the risk of misalignment, speeding up the process and minimising repair errors.
What material is the stencil plate made from, and what are its dimensions and thickness?
The stencil plate is typically made from stainless steel to ensure thermal resistance and durability. Approximate dimensions are 80 mm x 80 mm with a standard thickness of 0.12 mm, although this may vary slightly depending on the manufacturer.
Is it compatible only with iPhone 5C BGA chips, or also with other models or versions?
This stencil is specifically designed for the BGA ICs found in the iPhone 5C. Compatibility with other models is limited, as the pad layout can vary between iPhone versions and models.
What maintenance does the stencil plate require after continued use to ensure longevity?
We recommend cleaning the stencil plate after each use with isopropyl alcohol and a soft brush to prevent solder residue build-up. Storing it in a dry place helps prevent oxidation and warping, ensuring its precision for longer.
Are there significant differences in quality or precision compared with generic stencils or other models from the same brand?
In general, a dedicated stencil for the iPhone 5C offers greater ball alignment precision than generic models. The tolerances and aperture design are optimised for the specific chips in this model, reducing the risk of errors compared with universal stencils.
What is the iPhone 5C IC stencil plate used for?
It is used to make the BGA reballing process on the iPhone 5C easier, allowing precise soldering of the device's ICs.
Is this template compatible with other iPhone models?
No, this stencil plate is designed exclusively for the iPhone 5C to ensure repair accuracy.
What tools is this stencil plate used with?
It is used together with soldering stations and BGA reballing tools to apply direct heat during soldering.
What benefits does using this template offer in repairs?
It allows even heat application, improves reballing accuracy and reduces the risk of damaging electronic components.
Is the stencil plate reusable?
Yes, it is made from durable materials that allow multiple uses in repair workshops.
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