iPhone 7 IC stencil plate - BGA reballing template for precise repair
Brand: Mlink
VAT included (Ex VAT: 3.00 €)
Volume Discounts
| Quantity | Price | Save |
|---|---|---|
| 2+ | 3.54 € | -4% |
| 10+ | 3.36 € | -9% |
| 20+ | 2.95 € | -20% |
The iPhone 7 IC stencil plate is an essential tool for repairing iPhone 7 devices, specially designed to make the reballing process for BGA ICs easier using direct heat.
Made by Mlink, this high-precision template contains all the necessary patterns for working with the iPhone 7 BGA chips, ensuring a perfect fit and clean, efficient soldering.
- Compatibility: Exclusive to iPhone 7, covering all BGA ICs in the device.
- Professional use: Ideal for repair technicians carrying out reballing and electronic soldering on smartphones.
- Durable material: Designed to withstand high temperatures during the direct heat process.
- Precision: Allows exact application of solder balls, improving the quality and durability of the repair.
- Easy handling: Its design makes placement and removal easier during the soldering process.
This template is an essential accessory for mobile repair shops working with iPhone 7 and looking for professional, long-lasting results.
How to use the iPhone 7 IC stencil plate:
- Place the template over the iPhone 7 BGA chip.
- Apply the solder balls into the corresponding holes in the template.
- Carry out the direct heat process with a suitable soldering station to melt the balls and secure the connection.
- Carefully remove the template and check the soldering.
Compatibility and related accessories: This template is compatible with soldering stations and standard reballing tools. For best results, it is recommended to use it together with soldering accessories and consumables specific to iPhone 7.
- Direct heat template for iPhone 7 BGA ICs
- High precision for reballing and electronic soldering
- Material resistant to high temperatures
- Compatible exclusively with iPhone 7
- Easy to use for professional technicians
Customer Questions & Answers
What is the iPhone 7 IC stencil plate used for?
It is used to make reballing and soldering of the iPhone 7 BGA ICs easier using direct heat.
Is it compatible with other iPhone models?
No, this template is exclusive to iPhone 7 and its specific BGA ICs.
Can I use it with any soldering station?
It is compatible with soldering stations that support direct heat and standard reballing tools.
Is it currently available?
This product is out of stock. It is recommended to check alternative products or contact us for future availability.
How do you use the reballing template?
It is placed over the BGA chip, solder balls are applied, and the direct heat process is carried out to melt them and secure the connection.
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