Pack of 204 Direct Heat Stencils - Electronics Soldering Stencils
Brand: Mlink
VAT included (Ex VAT: 49.00 €)
Volume Discounts
| Quantity | Price | Save |
|---|---|---|
| 2+ | 57.86 € | -4% |
| 10+ | 56.05 € | -7% |
| 20+ | 51.23 € | -15% |
The Pack of 204 Direct Heat Stencils is a complete set of stencils designed to make the reballing process and electronics soldering with direct heat easier. This pack includes a wide variety of stencils for different solder ball sizes, from 0.30mm to 0.76mm, covering a wide range of chips and processors from well-known brands such as Intel, ATI, NVidia, VIA, SIS and video game consoles such as Xbox 360, PS3 and Wii.
Each stencil is manufactured with precision to ensure a perfect fit and an even distribution of the solder balls, resulting in reliable and long-lasting connections. This pack is ideal for technicians specialising in electronic board repair, especially in BGA (Ball Grid Array) reballing processes.
- Wide compatibility: Compatible with multiple Intel models (AM82801IUX, AC82GS45, BD82P55, etc.), ATI (1100, 21515, 216-0707011, X1300, X1600, etc.), NVidia (MCP67MV, NF-6100, GF104, GO6200, etc.), VIA, SIS and others.
- Variety of sizes: Stencils for 0.30mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm, 0.6mm and 0.76mm solder balls, covering different technical needs.
- Professional use: Perfect for BGA chip reballing, console repair and delicate electronic components.
- High-quality material: Made to withstand direct heat and ensure precision in every application.
This pack is an essential tool for professionals working in the repair and maintenance of electronic devices, offering a versatile and complete solution for direct heat soldering.
Note: The product is currently out of stock and not available for immediate purchase. Please check availability or alternative products in our store.
- Pack of 204 stencils for direct heat soldering.
- Compatible with solder balls from 0.30mm to 0.76mm.
- Suitable for Intel, ATI, NVidia, VIA, SIS chips and Xbox 360, PS3, Wii consoles.
- Enables precise and efficient BGA reballing.
- Heat-resistant material for professional use.
Customer Questions & Answers
What solder ball sizes are compatible with this stencil pack, and what advantages does the included variety offer?
The pack includes stencils compatible with 0.30 mm, 0.35 mm, 0.40 mm, 0.45 mm and 0.5 mm solder balls. This variety allows work on a wide range of BGA chips, making repairs across different platforms and generations easier. The range covers everything from small phone components to large motherboard and graphics chips, saving time and avoiding the need to buy individual stencils.
What material are the stencils made from, and what durability can be expected under professional use?
The stencils are generally made from stainless steel, which offers good thermal and mechanical resistance. In professional use, if handled properly (without forcing or bending), their service life usually exceeds 100 applications each before wear affects the accuracy of the solder ball mesh.
What installation precautions should be followed to avoid damage when using direct heat?
To avoid damage, it is essential to secure the stencil firmly over the chip, keep the hot air gun at a moderate distance (at least 3-5 cm) and use soldering temperatures within the range recommended by the chip manufacturer (usually between 200 °C and 300 °C). Excessive pressure or bending of the stencil should also be avoided.
How does this pack compare with universal or specific stencil kits in terms of versatility and limitations?
This pack is more versatile than specific stencils because it includes multiple patterns and sizes, covering dozens of common BGA chip models. Compared with a perforated universal stencil, it offers greater centring accuracy and less risk of errors caused by movement or misalignment. However, it does not cover every chip on the market; its strength lies in the listed models.
What maintenance do the stencils require after each use to ensure clean and accurate soldering?
It is recommended to clean the stencils carefully after each use with an anti-static brush and 99% isopropyl alcohol to remove flux and solder residue. They should be dried completely and stored flat to prevent warping. Good maintenance ensures a longer service life and more consistent soldering results.
What is the Pack of 204 Direct Heat Stencils used for?
This pack is used to make the reballing process and electronics soldering with direct heat easier, providing precise stencils for different solder ball sizes.
Which devices is it compatible with?
It is compatible with a wide range of Intel, ATI, NVidia, VIA, SIS chips and processors, as well as Xbox 360, PS3 and Wii consoles.
What solder ball sizes are included?
It includes stencils for 0.30mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm, 0.6mm and 0.76mm solder balls.
Is it available for immediate purchase?
The product is currently out of stock and not available for immediate purchase.
Is it suitable for professional use?
Yes, it is designed for technicians and professionals who carry out reballing and electronics repairs with direct heat.
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