Samsung S5 BGA stencil plate for reballing with Mlink tool

The stencil plate is generally made from stainless steel, which guarantees high resistance to heat and deformation during repeated reballing processes. This material provides a long service life and accurate alignment of the solder with the BGA array, although it is advisable to avoid excessive exposure to corrosive agents to maximise durability.

The dimensions are usually approximately 100 mm x 80 mm x 0.12 mm. The number of specific patterns may vary depending on the manufacturer, but it normally covers all the main BGA ICs in the Samsung S5, typically between 10 and 20 different patterns.

We recommend cleaning the plate with isopropyl alcohol after each use to remove solder and flux residue. It does not require lubrication or other special care, but it should be stored in a dry place to prevent corrosion or oxidation and avoid mechanical deformation.

Direct heat allows faster and more controlled solder melting, as the stencil remains fixed on the component; this improves precision when placing the balls. Compared with indirect methods (for example, manual masking templates), it reduces the margin for error and speeds up the process, although it does require experience to avoid localised overheating.

It is used to make the reballing process of the Samsung S5 BGA integrated circuits easier using direct heat, ensuring precise soldering.

No, this stencil plate is exclusive to the BGA integrated circuits of the Samsung S5.

The Samsung S5 stencil plate is made by Mlink, recognised for its professional soldering tools.

It is designed for professional use in repair workshops due to its precision and specialisation.