62.73 €
In Stock
Dual-Adjust Mobile Reballing Kit Compatible with 80 mm and 90 mm Stencils
Brand: Mlink
62.73€
VAT included (Ex VAT: 51.00 €)
Volume Discounts
| Quantity | Price | Save |
|---|---|---|
| 2+ | 64.94 € | |
| 10+ | 63.59 € | |
| 20+ | 59.53 € | -5% |
Only 4 left in stock - order soon!
Standard delivery
Fri, May 1 - Tue, May 5
Express delivery
Wed, Apr 29 - Thu, Apr 30
30-day returns
Free returns within 30 days
Secure transaction
Share:
Free Delivery
Shipping from €4.99
Easy Returns
30 day return policy
Secure Payment
100% secure checkout
Quality Guarantee
Original products only
Product description
The Dual-Adjust Mobile Reballing Kit is an advanced tool designed to make the reballing process easier on electronic components. This kit is compatible with 80 mm and 90 mm stencils, making it a unique and versatile model for different soldering needs.
Main features:
- Dual compatibility: Supports 80 and 90 mm stencils, allowing flexible use with different templates.
- Rotating base: Allows the parts holding the integrated circuit to be adjusted simply by turning a wheel, with no additional tools required, making chip placement and centring easier.
- Height adjustment: Exclusive system that allows the stencil height above the chip to be raised or lowered using adjusters, adapting to integrated circuits of different thicknesses, a unique feature of this model.
- Wide size range: Compatible with chips from 4x4 mm to 41x41 mm, including rectangular integrated circuits.
Typical uses:
This kit is ideal for technicians and professionals carrying out repairs and maintenance on electronic boards, especially BGA reballing work. Its design makes it easier to work with different chip sizes and thicknesses, improving precision and efficiency in the soldering process.
Compatibility and advantages:
- Compatible with a wide variety of stencils and chips.
- Tool-free adjustment speeds up the process and reduces the risk of errors.
- Height adjustment allows work with integrated circuits of varying thickness, increasing the kit's versatility.
In short, the Dual-Adjust Mobile Reballing Kit is a practical and efficient solution for professionals looking to improve their reballing processes with adaptable, easy-to-use equipment.
- Compatible with 80 mm and 90 mm stencils (dual model)
- Rotating base for tool-free adjustment
- Height adjustment to suit chips of different thicknesses
- Compatible with chips from 4x4 mm to 41x41 mm
- Supports rectangular integrated circuits
- Makes integrated circuit placement and centring easier
- Ideal for BGA reballing and electronic repairs
Customer Questions & Answers
What are the main construction materials and what is the total weight of the kit?
The kit is mainly made from aluminium alloy and stainless steel to combine mechanical strength and light weight. The total weight is typically around 700-900 g, depending on the exact manufacturer. These materials withstand continuous cycles without deforming or corroding.
What maintenance is recommended to ensure the kit's durability and accuracy?
It is recommended to clean the metal surfaces regularly with isopropyl alcohol and avoid the build-up of solder residue. Lightly lubricating the moving shafts every 3-6 months with dielectric grease helps minimise wear and preserve adjustment accuracy. Store it in a dry environment to prevent oxidation.
Which stencil sizes is this reballing kit compatible with?
This kit is compatible with 80 mm and 90 mm stencils, making it a unique dual model on the market.
Can I adjust the stencil height with this kit?
Yes, it has an exclusive height adjustment system that allows the stencil height above the chip to be raised or lowered to suit different thicknesses.
What chip sizes does this kit support?
It supports chips from 4x4 mm to 41x41 mm, including rectangular integrated circuits.
Do I need tools to adjust the parts that hold the integrated circuit?
No, thanks to its rotating base, adjustment is done by turning a wheel with no tools required.
What type of work is this kit ideal for?
It is ideal for BGA reballing work and electronic repairs that require precision and versatility in chip placement.
Write a customer review
Customers who bought this item also bought
-4%
Samsung Note 4 stencil plate for IC reballing - Mlink professional tool
3.54€
3.69 €
Only 2 left in stock
Your Recently Viewed Items
Dual-Adjust Mobile Reballing Kit Compatible with 80 mm and 90 mm Stencils
62.73 €