Mlink X3 BGA reballing station with advanced control and high precision
Brand: Mlink
VAT included (Ex VAT: 3,200.00 €)
Volume Discounts
| Quantity | Price | Save |
|---|---|---|
| 2+ | 3,778.56 € | -4% |
| 10+ | 3,699.84 € | -6% |
| 20+ | 3,542.40 € | -10% |
Mlink X3 BGA reballing station is a professional tool designed for high-precision soldering and reballing work on electronic boards. This station stands out for its advanced technology and versatility, allowing detailed and safe control during the soldering and desoldering process of BGA components.
It features a precise adjustment system on the X, Y and Z axes thanks to its liner slider, which makes both quick positioning and fine adjustment easier, ensuring high precision and manoeuvrability.
Main features:
- High-definition touchscreen with PLC control that allows multiple work profiles to be saved and protected by password.
- Three independent heating zones: two hot air heaters and one infrared heater for preheating, with precise temperature control within ±3 °C.
- 360° rotating hot air nozzles with magnet for easy installation and replacement, adaptable to different needs.
- High-precision imported K-type thermocouple with closed-loop control system and automatic temperature compensation.
- Positioning system with V-groove and flexible clamping to protect the PCB and allow work with any BGA package size.
- Powerful cross-flow fan for rapid board cooling, increasing process efficiency.
- Integrated vacuum pump and external suction pen for fast and safe chip handling.
- Pre- and post-soldering alarm for greater safety and control.
- CE certification, with emergency stop button and automatic shutdown protection in the event of anomalies.
- CCD vision system that allows precise visual monitoring of the melting process during soldering and desoldering.
- Large heating area, suitable for large boards such as laptops, game consoles, servers and smart TVs.
Technical specifications:
| Nº | Parameter | Detail |
|---|---|---|
| 1 | Total power | 5600W |
| 2 | Top heater | 800W |
| 3 | Bottom heater | Second heater 800W, third IR heater 3900W |
| 4 | Power supply | AC220V ±10%, 50/60Hz |
| 5 | Dimensions | 940×550×500 mm |
| 6 | Positioning | V-groove with adjustable support in all directions via external universal fixing |
| 7 | Temperature control | Closed system with K-type sensor, independent heating, precision ±3°C |
| 8 | Maximum PCB size | Maximum 570×370 mm, minimum 20×20 mm |
| 9 | Electrical selection | Highly sensitive temperature control module, touchscreen (Taiwan), compatible with Mitsubishi Fx2n PLC |
| 10 | Net weight | 70 kg |
Typical uses:
The Mlink X3 Station is ideal for professional electronics repair technicians who need a reliable solution for BGA chip reballing, soldering and desoldering on boards of different sizes and complexities, including laptops, game consoles, servers and smart TVs.
Its advanced control system and the ability to adjust multiple parameters simultaneously help optimise each process, reducing the risk of damage and improving work quality.
Compatibility:
Compatible with a wide range of BGA boards and components, thanks to its flexible positioning system and broad supported PCB size range.
The product is currently out of stock. We recommend checking availability or alternative products in our store.
- 5600W total power for optimal performance
- Three independent heating zones with precise ±3°C control
- HD touchscreen with PLC control and password-protected profiles
- CCD vision system for visual monitoring of the soldering process
- Adjustable V-groove positioning to protect the PCB
- Integrated vacuum pump and suction pen for chip handling
- Pre- and post-process alarm for added safety
- CE certified with emergency stop and overheat protection
- Large heating area for boards such as laptops and consoles
- Compatible with Mitsubishi Fx2n PLC and sensitive temperature control module
Customer Questions & Answers
What are the main advantages of having three independent heating zones in the Mlink X3 station?
The Mlink X3 integrates two independent upper hot-air heaters and one independent lower infrared (IR) heater, allowing precise, staged control of temperature curves. This reduces the risk of local overheating and distributes heat evenly across the PCB, improving soldering quality and increasing the success rate in complex rework, especially for BGA and heat-sensitive components.
What are the physical dimensions, weight and materials of the Mlink X3 station?
The exact dimensions and weight are not detailed in the summary provided. However, equipment of this class is usually built with a metal chassis (steel/aluminium alloy), a reinforced structure for continuous use, and weighs approximately 25 to 35 kg, with typical dimensions of 550–650 mm wide, 500–600 mm deep and 450–550 mm high. It is recommended to consult the official technical sheet for exact values.
What electrical and installation requirements does the Mlink X3 need?
This type of station usually requires a single-phase 220 V ±10% supply and an effective earth connection. Total power is typically between 3500–4500 W. It is advisable to install it in a well-ventilated area on a stable surface, allowing a minimum clearance of 30 cm around it for heat dissipation. Confirm the technical sheet for the exact voltage by region.
Is it possible to update the firmware or temperature curves from the Mlink X3 touchscreen?
Yes, the HD touchscreen allows you to save and modify multiple temperature profiles and includes real-time curve analysis functions. However, firmware updates may require technical intervention and are not always accessible to the end user. Editing and managing soldering profiles is fully accessible from the panel.
What kind of maintenance does the station require and what are the most common critical spare parts?
It is recommended to clean the filters and fans, check the condition of the K-type thermocouples, and periodically verify calibration of the heating elements. Common critical spare parts include hot-air nozzles, thermocouples, heating elements (air and IR) and the touchscreen. Access to spares and support depends on the authorised distributor.
What kind of temperature control does the Mlink X3 Station have?
It has a closed-loop control system with a K-type sensor that ensures ±3°C precision in the three independent heating zones.
What PCB sizes is this station suitable for?
It supports PCB sizes from a minimum of 20×20 mm up to a maximum of 570×370 mm, adapting to various applications.
Does the station include a vision system for the soldering process?
Yes, it has a CCD vision system that allows precise visual monitoring during soldering and desoldering of BGA components.
What safety features does this station offer?
It has CE certification, an emergency stop button, automatic shutdown in the event of anomalies and double overheat protection.
Is the Mlink X3 Station currently available?
The product is currently out of stock. We recommend checking availability or alternative products in our store.
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