233.70 €
In Stock
Puhui T-962 V2.0 Infrared Reflow Oven for PCB and SMD BGA Components
Brand: Puhui
233.70€
VAT included (Ex VAT: 190.00 €)
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Wed, Apr 29 - Fri, May 1
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Mon, Apr 27 - Tue, Apr 28
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Product description
The Puhui T-962 V2.0 infrared reflow oven is an advanced tool designed for precise and reliable soldering of printed circuit boards (PCB) and surface-mount devices (SMD), including BGA, QFP and PLCC. Its 180x230 mm work area makes it ideal for small to medium-sized projects, making it an excellent choice for electronics repairs, prototype production and educational environments.
Main features
- Compact 180 x 230 mm soldering area, suitable for small and medium PCB boards.
- Microprocessor-controlled heating system with PID control for uniform and repeatable results.
- Eight pre-programmed temperature profiles to suit different types of SMD and BGA components.
- Intuitive interface with a backlit LCD display showing the temperature curve in real time.
- Drawer-type chamber with infrared radiation and air circulation heating for efficient and even heating.
- USB connectivity for online operation via Windows-compatible software, making process customisation and control easier.
- CE certification ensuring quality and safety, with a durable metal housing and overheat protection.
- Plug-and-play setup with an automatic soldering cycle, with no specialist training required.
Technical specifications
- Model: T-962 V2.0
- Soldering area: 180 x 230 mm
- Power supply: 220V / 50Hz
- Maximum power: 800W
- Temperature range: from ambient temperature to 300°C
- Profiles: 8 preset temperature curves
- Display: Backlit LCD
- Control: Microprocessor-based PID
- Cooling system: Rapid cooling with air circulation
- Approximate dimensions: 320 x 290 x 170 mm
- Approximate weight: 9 kg
Typical uses
This oven is ideal for:
- Soldering and rework of SMD and BGA components on PCB boards.
- Repair of electronic devices and technical maintenance.
- Manufacture of electronic prototypes in laboratories and workshops.
- Educational applications for training in electronics and advanced soldering.
Compatibility
Compatible with a wide range of surface-mounted electronic components, including SMD, BGA, QFP and PLCC. Its Windows software allows temperature profiles to be adapted to the specific needs of each project.
Availability status
Currently, this product is out of stock. We recommend checking back regularly for updates on availability and possible restocks.
- Compact 180x230 mm work area for small and medium PCB boards
- PID microprocessor control for precise, repeatable soldering
- 8 pre-programmed temperature profiles for SMD, BGA, QFP and PLCC
- Backlit LCD display with real-time temperature curve view
- Drawer-style chamber with infrared heating and air circulation
- USB connectivity for control and customisation via Windows software
- CE certification, metal housing and overheat protection
- Plug-and-play setup with automatic cycle, no special training required
Customer Questions & Answers
What is the operating temperature range and the thermal control accuracy of the oven?
The oven typically operates in a range from 100 °C to 350 °C, with a maximum deviation of ±5 °C according to the manufacturer’s specifications. Microprocessor thermal control allows predefined temperature profiles to be run for lead-free and leaded solder paste, although small deviations may occur under maximum load or with high ambient airflow.
What are the electrical requirements and connector type needed for this reflow oven?
The Puhui T-962 V2.0 requires AC mains supply of 220 V ±10% (50 Hz), with maximum consumption of 800 W during the heating cycle. The unit uses a standard European Schuko mains connector. For other voltages or plugs, an adapter/conversion in line with local regulations is required.
What common problems can arise during operation and how can they be resolved?
The most commonly reported issues are inconsistent temperatures due to poor insulation, odour from solder paste fumes, and internal fan failures. It is recommended to check the temperature sensor regularly, clean residue, improve room ventilation and, in the event of a fault, contact the distributor for spare parts. Checking for cold or incomplete solder joints may require adjustments to the thermal profile.
What periodic maintenance is recommended to extend the oven’s service life?
It is advisable to clean the inside of the oven after each use to remove flux residue and prevent the build-up of corrosive fumes; check the condition of the fan and cables; and verify thermal adjustment every six months. Following these steps improves durability and reduces the risk of premature faults.
What size PCB boards can I solder with this oven?
The oven has a 180x230 mm soldering area, suitable for small to medium-sized boards.
Is it compatible with BGA components?
Yes, the Puhui T-962 V2.0 is compatible with SMD components, including BGA, QFP and PLCC.
Can I control the oven from a computer?
Yes, it has a USB connection and is compatible with Windows software for online control and profile customisation.
Is the oven available to buy?
Currently the product is out of stock and not available for immediate purchase.
Do I need special training to use this oven?
No, it has plug-and-play setup and automatic cycles that make it easy to use without specialist training.
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Puhui T-962 V2.0 Infrared Reflow Oven for PCB and SMD BGA Components
233.70 €