396.06 €
In Stock
T-962A Puhui V2.0 infrared reflow oven for SMD and BGA soldering
Brand: Puhui
396.06€
VAT included (Ex VAT: 322.00 €)
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T-962A V2.0 Puhui Infrared Reflow Oven is an advanced tool designed for electronics professionals working with SMD, BGA and other types of electronic components on PCB boards. This oven offers an efficient and precise solution for reballing, repair and printed circuit board assembly processes.
Main features
- Soldering area: 300 x 320 mm, ideal for medium-sized boards.
- Advanced infrared technology: ensures even heat distribution to avoid damage to components.
- Eight preset temperature profiles: to adapt to different soldering types and materials.
- Precise digital control: via microprocessor that ensures reliable and repeatable operation.
- Backlit LCD display: with an intuitive interface to make programming and monitoring easier.
- Compatible software: for online operation via USB, compatible with Windows systems.
- Component compatibility: supports SMD, BGA, SOP, PLCC, QFP and other common formats.
- Timer and automatic rapid cooling: to optimise working times and protect components.
- Robust metal housing and active ventilation: to ensure durability and safety during use.
Benefits for the user
This infrared reflow oven provides professional versatility, time savings and complete precision in soldering processes. Its ease of use and multiple applications make it an essential tool for technicians, professionals and electronics enthusiasts.
Recommended use cases
- Mobile phone and motherboard repair workshops.
- Small-batch PCB production.
- Educational electronics labs.
- Hardware research and development.
- Reballing and reuse of BGA/SMD components.
Warranty and returns policy
The oven comes with a 2-year warranty. Returns are accepted according to the seller's policy in the event of manufacturing defects.
Upgrade your workstation with the T-962A Puhui V2.0 infrared reflow oven and improve the precision, safety and efficiency of your electronics soldering processes!
- Soldering area: 300 x 320 mm
- Advanced infrared technology with even heat distribution
- 8 preset temperature profiles
- Precise microprocessor control
- Backlit LCD display with intuitive interface
- Software for online operation via USB compatible with Windows
- Compatible with SMD, BGA, SOP, PLCC, QFP components
- Timer and automatic rapid cooling
- Robust metal housing and active ventilation
- 2-year warranty and returns policy for manufacturing defects
Customer Questions & Answers
What advantages does the digital control of the T-962A V2.0 Reflow Oven offer over analogue models?
Digital control allows temperature profiles to be selected and adjusted with greater precision and repeatability, minimising human error and improving performance in SMD/BGA soldering. Analogue models often have thermal fluctuations and lower accuracy, which can affect work quality.
What types of boards or components are compatible with the T-962A V2.0’s 300 x 320 mm working area?
PCB boards, SMD modules and BGA components that do not exceed 300 x 320 mm and respect the oven’s maximum internal height (approximately 50 mm) can be processed. It is suitable for both prototypes and limited-production boards.
What are the electrical requirements and connector type for installing the oven?
The T-962A V2.0 operates on 220 V~240 V AC, 50/60 Hz, with a consumption of up to 2.7 kW. It uses a standard Type C or F connector (European). Checking compatibility with the local mains supply beforehand is essential.
What preventive maintenance tasks does this oven require to maintain long-term performance?
It is recommended to clean the filters, tray and temperature sensors regularly, check connections and inspect the infrared emitters. It is important to avoid flux residue build-up inside the chamber, as this can damage the sensors and affect the temperature curve.
How does the T-962A V2.0 compare with forced-convection ovens in terms of heat uniformity and BGA soldering results?
The T-962A V2.0 uses infrared radiation, which can create slight temperature differences in very dense or shaded areas of the PCB compared with convection ovens, which achieve a more even distribution. However, for most semi-professional BGA/SMD jobs, the result is satisfactory if the temperature profiles are set correctly.
What types of components is the T-962A Puhui reflow oven suitable for?
It is suitable for SMD, BGA, SOP, PLCC, QFP and other common formats in electronics.
What soldering area does the oven have?
The oven has a soldering area of 300 x 320 mm, ideal for medium-sized boards.
Does the oven have programmable temperature profiles?
Yes, it has 8 preset temperature profiles for different soldering types.
Is the oven compatible with software for remote control?
Yes, it includes software for online operation via USB compatible with Windows systems.
What is the product warranty?
The oven comes with a 2-year warranty and accepts returns for manufacturing defects according to the seller's policy.
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T-962A Puhui V2.0 infrared reflow oven for SMD and BGA soldering
396.06 €