Zhuomao 16x16 mm BGA Nozzle Compatible with MLINK and Zhenxun

Zhuomao BGA Nozzle 16 x 16 mm

This 16 x 16 mm hot air nozzle from Zhuomao is specifically designed for soldering and reballing stations, compatible with MLINK and Zhenxun models. Its size and shape allow even and precise heating of BGA components, making soldering and integrated circuit repair easier.

Key features:

• Dimensions: 16 x 16 mm, suitable for medium-sized BGA chips.
• Compatibility: Compatible with MLINK and Zhenxun soldering stations, ensuring a perfect fit and optimal operation.
• Durable material: Made from hard-wearing materials for long-lasting use in electronics repair environments.
• Efficient design: Allows controlled airflow to avoid damage to nearby components.

Typical uses:

• Repair and reballing of BGA chips on motherboards and electronic devices.
• Soldering electronic components that require precision and thermal control.
• Maintenance and replacement in compatible soldering stations.

Compatibility and recommendations:

This nozzle is especially recommended for technicians and professionals using MLINK and Zhenxun soldering stations. Its specific design ensures smooth integration and reliable performance during rework and soldering operations.

Note: This product is currently out of stock. We recommend checking availability for future purchases.

• 16 x 16 mm hot air nozzle for BGA components
• Compatible with MLINK and Zhenxun stations
• Durable material for long-lasting use
• Design allows precise, controlled airflow
• Ideal for reballing and BGA chip repair