Zhuomao BGA Nozzle 55 x 60 mm compatible with MLINK and Zhenxun for soldering stations
Brand: Zhuomao
VAT included (Ex VAT: 14.00 €)
Volume Discounts
| Quantity | Price | Save |
|---|---|---|
| 2+ | 16.53 € | -4% |
| 10+ | 16.01 € | -7% |
| 20+ | 14.29 € | -17% |
Zhuomao BGA Nozzle 55 x 60 mm (compatible with MLINK and Zhenxun)
This Zhuomao BGA nozzle is an essential accessory for soldering and reballing stations, specifically designed to deliver optimum performance in BGA component repair processes. Compatible with MLINK and Zhenxun models, this nozzle provides even hot air distribution, making chip soldering and desoldering easier with precision.
- Compatibility: Designed for MLINK and Zhenxun soldering stations.
- Dimensions: 55 x 60 mm, suitable for medium-sized BGA work.
- Material: Robust construction for strength and durability during use.
- Recommended use: Ideal for reballing, repair and maintenance of BGA components on electronic boards.
- Benefits: Improves hot air flow efficiency, ensuring even heating and reducing the risk of heat damage.
Typical applications: This nozzle is perfect for technicians and professionals working with soldering stations in electronic repair, especially for BGA chip repair in devices such as mobile phones, consoles, and motherboards.
Availability: This product is currently out of stock. We recommend checking compatible alternatives or subscribing to receive notifications when it is back in stock.
- Compatible with MLINK and Zhenxun soldering stations
- Precise 55 x 60 mm dimensions for BGA work
- Robust construction for greater durability
- Optimises hot air flow for precise soldering
- Ideal for reballing and BGA component repair
Customer Questions & Answers
What applications is the Zhuomao 55x60 mm BGA nozzle best suited for?
This nozzle is optimised for rework and soldering of large BGA components on circuit boards, allowing specific areas to be heated without affecting nearby components, making it ideal for repair work in consumer electronics and telecommunications.
What are the manufacturing materials and approximate weight of the nozzle?
The Zhuomao nozzle is made from stainless steel, known for its heat and corrosion resistance. The approximate weight is 120 to 140 g, depending on slight manufacturing variations.
What preventive maintenance procedures are recommended to maximise the nozzle’s durability?
It is recommended to clean the nozzle after each use to prevent flux and residue build-up, periodically inspect the integrity of the material and avoid mechanical impacts that could deform its geometry. Cleaning with a soft brush and non-corrosive solvent is sufficient in most cases.
Compared with smaller nozzles, what advantages and limitations does the 55x60 mm nozzle have in terms of heat transfer and precision?
The 55x60 mm nozzle allows more even heat transfer on larger components, reducing the risk of localised overheating. However, it sacrifices precision in smaller areas, so it is not recommended for small components or those placed very close together.
Which soldering stations is this nozzle compatible with?
It is compatible with MLINK and Zhenxun soldering stations.
What is the size of the Zhuomao BGA nozzle?
The nozzle measures 55 x 60 mm.
Can I use this nozzle for reballing?
Yes, it is specifically designed for reballing and BGA component repair work.
Is the product available for immediate purchase?
It is currently out of stock. We recommend checking alternatives or subscribing for availability notifications.
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