17.22 €
In Stock
BGA Nozzle 20x130 mm compatible with Zhuomao, Mlink and Zhenxun for soldering stations
Brand: Zhuomao
17.22€
VAT included (Ex VAT: 14.00 €)
Volume Discounts
| Quantity | Price | Save |
|---|---|---|
| 2+ | 17.71 € | |
| 10+ | 17.16 € | |
| 20+ | 15.31 € | -11% |
Only 5 left in stock - order soon!
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Product description
The BGA nozzle 20x130 mm compatible with Zhuomao is an accessory designed for soldering and reballing stations, especially compatible with the Zhuomao, Mlink and Zhenxun brands. This replacement part is essential for electronic repair work that requires precise heat application to BGA components.
Main features:
- Dimensions: 20 mm diameter by 130 mm length.
- Compatibility: Zhuomao, Mlink and Zhenxun.
- Heat-resistant material to ensure durability and performance.
- Specific design for BGA soldering stations and reballing processes.
Typical uses:
- Repair and maintenance of electronic boards with BGA components.
- Replacement for worn nozzles in Zhuomao, Mlink and Zhenxun soldering stations.
- Optimisation of reballing processes to improve precision and efficiency.
Compatibility and maintenance:
This nozzle is compatible with soldering stations from the Zhuomao, Mlink and Zhenxun brands, making it easy to fit without the need for additional adapters. To maintain performance, it is recommended to clean the nozzle regularly and avoid knocks or drops that could deform it.
Additional benefits:
- Helps provide even and controlled heating in BGA processes.
- Improves the quality of electronic repairs.
- Extends the service life of the soldering station by replacing worn parts.
This replacement part is ideal for technicians and professionals looking to keep their soldering stations in optimum condition, ensuring precise and reliable results in every repair.
- Dimensions: 20 mm x 130 mm, ideal for BGA components
- Compatible with Zhuomao, Mlink and Zhenxun stations
- Heat-resistant material for greater durability
- Specific design for reballing and BGA soldering processes
- Easy to install and maintain for a longer service life
Customer Questions & Answers
Are there any specific safety precautions when fitting or using this nozzle on a rework station?
Yes. It is recommended to ensure it is properly secured to prevent hot-air leaks that could damage nearby components. Use heat-resistant gloves when fitting it while hot and keep the nozzle clean to avoid blockages. It complies with CE regulations for hot-air soldering equipment.
What are the recommended operating limits for temperature and airflow when using this nozzle?
For standard BGA work, the nozzle withstands temperatures of up to 500°C and a typical airflow of 10-30 L/min. Exceeding these values may cause deformation or reduce the accessory's service life.
How does this 20 x 130 mm rectangular nozzle compare with circular nozzles in terms of heat distribution and use cases?
Rectangular nozzles such as the 20 x 130 mm model distribute hot air evenly across large-area components or multiple rows of pads, reducing thermal gradients. Circular nozzles are more versatile for small chips or specific points. The choice depends on the size and design of the BGA to be repaired.
Which soldering stations is this nozzle compatible with?
It is compatible with Zhuomao, Mlink and Zhenxun soldering stations.
What is the size of the nozzle?
The nozzle measures 20 mm in diameter and 130 mm in length.
What type of repairs is this nozzle suitable for?
It is suitable for repairs and reballing processes for BGA components on electronic boards.
Is this nozzle easy to install on the soldering station?
Yes, it is designed for easy installation on compatible stations without the need for additional adapters.
How should the nozzle be maintained to ensure durability?
It is recommended to clean it regularly and avoid knocks or drops that could damage it.
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