Zhuomao BGA Nozzle 18x18 Compatible with Mlink and Zhenxun for Soldering Stations

Zhuomao BGA nozzle 18 x 18 mm compatible with Mlink and Zhenxun

This 18 x 18 mm Zhuomao BGA nozzle is a spare part designed for soldering and reballing stations. Compatible with Mlink and Zhenxun station models, this nozzle is ideal for precise work on BGA (Ball Grid Array) electronic components.

Main features:

• Dimensions: 18 x 18 mm, suitable for medium-sized BGA components.
• Compatibility: Compatible with Mlink and Zhenxun soldering stations.
• Durable construction material to ensure longevity and performance in soldering processes.
• Optimised design for even hot air distribution, making BGA soldering and reballing easier.

Typical uses:

• Repair and maintenance of circuit boards with BGA components.
• Reballing and chip soldering on compatible Mlink and Zhenxun stations.
• Applications in automotive electronics, computing and telecommunications.

Compatibility and recommendations:

This nozzle is compatible exclusively with soldering and reballing stations from the Mlink and Zhenxun brands. We recommend checking compatibility with your specific station model before purchase. As a specific spare part, it ensures a perfect fit and optimum performance for BGA soldering tasks.

Availability status: This product is currently out of stock. We recommend checking future availability or alternative products in our store.

• 18 x 18 mm BGA soldering nozzle
• Compatible with Mlink and Zhenxun stations
• Durable material for long-lasting use
• Even hot air distribution
• Ideal for BGA component repair and reballing