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Zhuomao BGA Nozzle 55x55 compatible with Mlink and Zhenxun for soldering stations

Brand: Zhuomao

17.22

VAT included (Ex VAT: 14.00 €)

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Product description

The Zhuomao BGA Nozzle 55x55 compatible with Mlink and Zhenxun is a high-quality spare part designed for soldering stations and reballing tools. This accessory is essential for directing hot air flow precisely during the soldering process of BGA (Ball Grid Array) components, ensuring efficient and safe repair.

Main features:

  • Dimensions: 55 x 55 mm, ideal for medium-sized BGA components.
  • Compatibility: Designed for Mlink and Zhenxun soldering stations, making integration easy without the need for additional adapters.
  • Durable, hard-wearing material suitable for repeated use in demanding work environments.
  • Allows precise control of the hot air flow, improving soldering quality and reducing the risk of damage to sensitive components.

Typical uses:

  • Repair and reballing of BGA chips on electronic boards.
  • Use in soldering stations for precision electronics work.
  • Replacement for damaged or worn nozzles to maintain equipment efficiency.

Compatibility and recommendations:

  • Compatible with Mlink and Zhenxun soldering stations, two well-known brands in the electronic repair sector.
  • We recommend checking compatibility with your specific station model before purchase.
  • Ideal for technicians and professionals who need reliable spare parts for their soldering tools.

This spare part is a practical solution for maintaining and optimising the performance of your soldering station, ensuring consistent results in reballing and electronic repair work.

Note: Product currently out of stock. Please check availability or alternatives in our store.

  • Precise 55 x 55 mm dimensions for BGA components.
  • Compatible with Mlink and Zhenxun soldering stations.
  • Made from durable materials for long-lasting use.
  • Optimises hot air flow for precise soldering.
  • Ideal for BGA chip repair and reballing.

Customer Questions & Answers

What is the nozzle made of, and how does that affect durability during continuous use on a BGA station?

The nozzle is made from stainless steel, which gives it good mechanical and thermal resistance at the typical operating temperatures of BGA stations. This material minimises heat-related deformation and reduces corrosion, increasing service life in standard rework applications.

What care and maintenance does the nozzle require to ensure optimum performance and avoid blockages?

It is recommended to clean the nozzle after each use to remove solder residue and accumulated dirt, preferably using soft brushes and non-aggressive solvents. Avoid abrasive tools so as not to damage the internal surface, which could affect airflow distribution.

Compared with other nozzles of similar dimensions, does it offer any functional advantage in terms of thermal efficiency or air distribution?

The thermal efficiency and air distribution of this nozzle are functionally equivalent to the industry standard for 55 x 55 mm stainless steel nozzles. It does not offer significant advantages over well-made alternatives of the same format, but it does ensure consistent heat transfer and easy maintenance.

Which soldering stations is this BGA nozzle compatible with?

This nozzle is compatible with Mlink and Zhenxun soldering stations, making it suitable for use with equipment from these brands.

What size is the Zhuomao BGA nozzle?

The nozzle measures 55 x 55 mm, suitable for medium-sized BGA components.

Can I use this nozzle for reballing?

Yes, it is designed for reballing and BGA chip repair processes, providing controlled hot air flow.

Is it currently available to buy?

The product is currently out of stock. We recommend checking availability or looking for alternatives in the store.

Do I need an adapter to use this nozzle on my station?

No, the nozzle is directly compatible with Mlink and Zhenxun stations, so no additional adapters are required.

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